Corrosion inhibitors for metal chemical mechanical planarization (CMP) polishing compositions
TW202635832APending Publication Date: 2026-09-01VERSUM MATERIALS US LLC
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Patent Information
- Application Number
- TW115102760
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-29
- Filing Date
- 2026-01-23
- Publication Date
- 2026-09-01
Abstract
Chemical Mechanical Planarization (CMP) polishing compositions, methods and systems for polishing metal such as copper are provided. The CMP polishing compositions use non-triazole corrosion inhibitor. The CMP polishing compositions have demonstrated exceptional copper corrosion protection while enabling high copper removal rates.
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