Planarization solution for abrasive-free copper planarization

TW202635833APending Publication Date: 2026-09-01CHEMPOWER CORP
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Patent Information

Application Number
TW115102058
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-17
Filing Date
2026-01-19
Publication Date
2026-09-01

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Abstract

Examples are disclosed that relate to a planarization solution for abrasive-free planarization. The planarization solution comprises a hydrolyzing agent, a first chelator, and a second chelator.
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