Semiconductor film adhesives, and semiconductor devices and manufacturing methods thereof

TW202635842APending Publication Date: 2026-09-01RESONAC CORP
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Patent Information

Application Number
TW114147507
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-04
Filing Date
2025-12-04
Publication Date
2026-09-01

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Abstract

A semiconductor film adhesive is disclosed, comprising a thermosetting resin, a curing agent, a thermoplastic resin, and an alumina filler surface-treated with a silane coupling agent. Based on the total amount of the semiconductor film adhesive, the content of the alumina filler surface-treated with a silane coupling agent is 50% by mass or more.
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