Slurry, grinding method and manufacturing method of parts
TW202635854APending Publication Date: 2026-09-01RESONAC CORP
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Patent Information
- Application Number
- TW115101639
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-17
- Filing Date
- 2026-01-15
- Publication Date
- 2026-09-01
Abstract
A slurry comprising abrasive grains and water, the abrasive grains comprising cerium oxide particles, wherein the height of the peak at the (111) plane of the cerium oxide particles, obtained by Raman spectroscopy analysis using a light source at a wavelength of 457 nm, is at least 0.95% higher than the height of the peak at the F2g vibrational mode of the cerium oxide. A grinding method comprising the step of grinding a workpiece using the slurry. A method for manufacturing a part comprising the step of obtaining a part using a workpiece ground by the grinding method.
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