Slurry, grinding method and manufacturing method of parts

TW202635854APending Publication Date: 2026-09-01RESONAC CORP
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Patent Information

Application Number
TW115101639
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-17
Filing Date
2026-01-15
Publication Date
2026-09-01
Patent Text Reader

Abstract

A slurry comprising abrasive grains and water, the abrasive grains comprising cerium oxide particles, wherein the height of the peak at the (111) plane of the cerium oxide particles, obtained by Raman spectroscopy analysis using a light source at a wavelength of 457 nm, is at least 0.95% higher than the height of the peak at the F2g vibrational mode of the cerium oxide. A grinding method comprising the step of grinding a workpiece using the slurry. A method for manufacturing a part comprising the step of obtaining a part using a workpiece ground by the grinding method.
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