Slurry, grinding method and manufacturing method of parts

TW202635855APending Publication Date: 2026-09-01RESONAC CORP
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Patent Information

Application Number
TW115101640
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-17
Filing Date
2026-01-15
Publication Date
2026-09-01
Patent Text Reader

Abstract

A slurry comprising abrasive grains and water, the abrasive grains comprising cerium oxide particles, wherein in the Raman spectrum of the cerium oxide particles obtained by Raman spectroscopy analysis using a light source at a wavelength of 457 nm, the ratio of the height of the peak belonging to peroxide ions to the height of the peak of the F2g vibrational mode belonging to cerium oxide is 0.05% or more. A grinding method comprising the step of grinding a workpiece using the slurry. A method for manufacturing a part comprising the step of obtaining a part using a workpiece ground by the grinding method.
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