Chemical-mechanical polishing composition
TW202635869APending Publication Date: 2026-09-01DONGJIN SEMICHEM CO LTD
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Patent Information
- Application Number
- TW114150146
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-12-30
- Filing Date
- 2025-12-19
- Publication Date
- 2026-09-01
Abstract
This invention provides a chemomechanical abrasive composition comprising abrasive particles with a positive zeta potential due to surface modification, a pH adjuster, an organic acid, and a strong base. The strong base has a pH of 12.0 or higher in a 100 mM aqueous solution at room temperature and satisfies the following equation: <Equation 1> 4.5 ≤ Z*C / (BA)-10*D ≤ 20.0
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