Three-dimensional vapor chamber assembly structure
TW202636058APending Publication Date: 2026-09-01TAIWAN MICROLOOPS CORP
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Patent Information
- Application Number
- TW114107151
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-02-26
- Publication Date
- 2026-09-01
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Figure TWG2TA001074018_001 
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Figure TWG2TA001074018_003
Abstract
A three-dimensional vapor chamber assembly structure includes a housing, a heat pipe, a capillary and a working fluid. The housing includes a first shell plate and a second shell plate. A cavity is formed between the first shell plate and the second shell plate. A hole is arranged in the second shell plate. The heat pipe having an open end. The open end having a flange. The flange includes a transverse plane and a longitudinal plane. Wherein the transverse plane of the flange is bonded to the second shell plate through a welded layer, and the longitudinal plane of the flange is bonded to the second shell plate through a welded element. The capillary is arranged in the cavity and attached to the housing. The working fluid is in the cavity.
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