Wafer end-face shape evaluation method

Abstract

A wafer end-face shape evaluation method, which is capable of quantitatively evaluating a degree of similarity between end-face shapes at two positions, is provided. End-face shapes at two positions are measured (Step S1). XY coordinates of two sets of end-face shape data are acquired (Step S2). The XY coordinates are converted into Rθ polar coordinates (Step S3). The two sets of end-face shape data are represented on an Rθ rectangular coordinates plane in which a horizontal axis is set to θ and a vertical axis is set to R (Step S4). On the Rθ rectangular coordinates plane, an average value of each R is subtracted from each end-face shape data (Step S5). On the Rθ rectangular coordinates plane, a difference R' of R between the two sets of end-face shape data is obtained (Step S6). As an example, a root mean square RMS of R' is calculated (Step S7). Based on the RMS, the degree of similarity of end-face shapes is evaluated (Step S8).

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