Semiconductor manufacturing system and deformation detection method

TW202636092APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115103455
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-07
Filing Date
2026-01-29
Publication Date
2026-09-01

Smart Images

  • Figure 00000000_0001_ABST
    Figure 00000000_0001_ABST
  • Figure 00000000_0000_ABST
    Figure 00000000_0000_ABST
Patent Text Reader

Abstract

The semiconductor manufacturing system of the present invention includes: a transport device for transporting at least one of a substrate and a consumable part as the transported object; and an end effector disposed at the end of the transport device to support the transported object. Furthermore, the semiconductor manufacturing system includes: a deformation detection unit for detecting information regarding the deformation of the end effector; and an information processing unit for acquiring the detection information from the deformation detection unit and understanding the deformation state of the end effector based on the detection information. Thus, the semiconductor manufacturing system can effectively understand the deformation of the end effector supporting the transported object in the transport device.
Need to check novelty before this filing date? Find Prior Art