Automated optical inspection device

Abstract

The present disclosure discloses an automatic optical inspection device, belonging to the field of semiconductor chip appearance defect detection technology. It includes: a camera assembly, a reflective assembly, an external coaxial light source, and a position adjustment mechanism. The reflective assembly is located on one side of the camera assembly and is used to reflect the chip's imaging light to the camera assembly. The external coaxial light source is positioned between the camera assembly and the reflective assembly and is used to emit chip imaging light towards the reflective assembly. The reflective assembly is also used to reflect the light from the external coaxial light source back to the chip. The position adjustment mechanism has an adjustable movable end that is close to the reflective assembly, and the camera assembly is mounted on the movable end. By changing the internal coaxial light source to an external coaxial light source, the hardware defect of lamp bead halo is avoided. By setting a position adjustment mechanism, the distance between the camera component and the reflective component can be adjusted, thereby improving the product's working efficiency and ease of use.

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