Side optical couplers for advanced package architectures

Abstract

A device may include an electronic-photonic assembly comprising: a photonic integrated circuit (PIC) comprising a waveguide extending near a sidewall of the PIC, an electronic integrated circuit (EIC) attached to the PIC; and an encapsulant at least partially encapsulating the EIC. A device may include an optical assembly comprising a detachable plug and a fiber attached to the detachable plug. A device may include an optical coupler between the sidewall of the PIC and the optical assembly, wherein the optical coupler is configured to couple light received from the waveguide to the fiber.

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