Lens module and test probe card

TW202636164APending Publication Date: 2026-09-01XINGR TECHNOLOGIES (ZHEJIANG) LTD
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Patent Information

Application Number
TW114125315
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-21
Filing Date
2025-07-03
Publication Date
2026-09-01

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Abstract

This invention relates to the field of CIS wafer testing technology, specifically to a lens module and a test probe card. The lens module includes: a substrate with multiple spaced and extending openings; and multiple objective lenses, each mounted in one of the openings via a position adjustment mechanism. The position adjustment mechanism includes multiple vertical adjustment mechanisms and multiple horizontal adjustment mechanisms. Each objective lens can have its vertical distance or angle adjusted relative to the corresponding test object via the vertical adjustment mechanism, and its horizontal position adjusted via the horizontal adjustment mechanism. Each objective lens also has its focal length adjusted via both the vertical and horizontal adjustment mechanisms. This lens module allows for individual focal length adjustment, ensuring accurate focusing of the objective lenses and enabling the light signal to be aligned with the test area of ​​the CIS wafer.
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