Method for improving throughput of packaging lithography at lower resolutions

TW202636227APending Publication Date: 2026-09-01ONTO INNOVATION INC
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Patent Information

Application Number
TW114151470
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-30
Filing Date
2025-12-26
Publication Date
2026-09-01

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Abstract

The present application provides a method for improving throughput of lithography at lower resolutions in substrate fabrication. The disclosure utilizes combining photolithography with direct writing lithography in substrate fabrication. The method comprises of, exposing with photolithography equipment circuit patterns on a substrate of at least one-micron resolution and larger in a photoresist, wherein the field size is at least
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