System and method for plasma pulsing scheme selection and optimization

TW202636234APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW114140346
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-07-08
Filing Date
2025-10-20
Publication Date
2026-09-01

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Abstract

A method includes determining process parameters of a plasma process based on a desired objective function and determining a pulsing scheme of the plasma process based on the desired objective function. The pulsing scheme includes a pulsing petameter matrix including timing and power-level parameters of a radio frequency (RF) source power supply and a bias power supply. The method includes sending the process parameters and the pulsing scheme to a plasma apparatus, introducing a substrate into a process chamber of the plasma apparatus, and performing the plasma process on the substrate using the process parameters and the pulsing scheme.
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