Heat dissipation device with communication function

Abstract

A heat dissipation device with a communication function includes a conductive substrate, a plurality of general heat sink elements, and one or more specific heat sink elements. The conductive substrate has a feeding port. The general heat sink elements are coupled to the conductive substrate. The specific heat sink elements are coupled to the conductive substrate, and are disposed between the general heat sink elements. Each of the specific heat sink elements has a notch. A first antenna structure is formed by the conductive substrate and the specific heat sink elements.

Description

[Technical Field]

[0001] This invention relates to a heat dissipation device, and more particularly to a heat dissipation device with communication function. [Previous Technology]

[0002] With the development of mobile communication technology, mobile devices have become increasingly common in recent years. Common examples include laptops, mobile phones, multimedia players, and other portable electronic devices with mixed functions. To meet people's needs, mobile devices usually have wireless communication capabilities. Some cover long-range wireless communication ranges, such as mobile phones using 2G, 3G, and LTE (Long Term Evolution) systems and the frequency bands they use: 700MHz, 850MHz, 900MHz, 1800MHz, 1900MHz, 2100MHz, 2300MHz, and 2500MHz. Others cover short-range wireless communication ranges, such as Wi-Fi and Bluetooth systems using the frequency bands of 2.4GHz, 5.2GHz, and 5.8GHz.

[0003] Antennas are an indispensable component in mobile devices that support wireless communication. However, due to the limited internal space of mobile devices and various head-mounted devices such as VR (Virtual Reality), AR (Augmented Reality), MR (Mixed Reality), and XR (Extended Reality), it is often impossible to accommodate large-sized antenna components. Therefore, it is necessary to propose a completely new solution to overcome the problems faced by traditional technologies. [Summary of the Invention]

[0004] In a preferred embodiment, the present invention provides a heat dissipation device with communication function, comprising: a conductive substrate having a feed port; a plurality of ordinary heat sinks coupled to the conductive substrate; and one or a plurality of specific heat sinks coupled to the conductive substrate and disposed between the ordinary heat sinks, wherein each of the specific heat sinks has a notch; wherein the conductive substrate and the specific heat sinks together form a first antenna structure.

[0005] In some embodiments, the general heat sinks and the specific heat sinks are generally parallel to each other.

[0006] In some embodiments, the notches of the particular heat sinks are generally arranged on the same straight line.

[0007] In some embodiments, the first antenna structure covers a first frequency band, which is between 26 GHz and 71 GHz.

[0008] In some embodiments, each of the notches of the particular heat sink is generally in the shape of an inverted isosceles triangle, an equilateral triangle, a semicircle, an arc, or a square.

[0009] In some embodiments, the length of the base of the isosceles triangle is between 0.1 times and 5 times the wavelength of the first frequency band.

[0010] In some embodiments, the height of the isosceles triangle is between 0.1 times and 5 times the wavelength of the first frequency band.

[0011] In some embodiments, the distance between any two adjacent ordinary heat sinks and specific heat sinks is less than or equal to 0.25 times the wavelength of the first frequency band.

[0012] In some embodiments, the heat dissipation device further includes: a feed section coupled to a signal source, wherein the conductor substrate, the general heat sink, the specific heat sink, and the feed section together form a second antenna structure.

[0013] In some embodiments, the second antenna structure covers a second frequency band, which may be the same as or different from the first frequency band.

[0014] In some embodiments, the feed port is adjacent to the specific heat sink.

[0015] In another preferred embodiment, the present invention provides a heat dissipation device with communication function, comprising: a conductive substrate; a plurality of specific heat sinks coupled to the conductive substrate, wherein each of the specific heat sinks has a notch; and a waveguide having a feed port, wherein a plurality of slots are formed on the waveguide, and the notches of the specific heat sinks are used to accommodate the waveguide; wherein the waveguide serves as a first antenna structure.

[0016] In some embodiments, these particular heat sinks are generally parallel to each other.

[0017] In some embodiments, each of the notches of the particular heat sink is generally rectangular or square.

[0018] In some embodiments, the slots of the waveguide are generally parallel to each other.

[0019] In some embodiments, the first antenna structure covers a first frequency band, and the length of each of the slots of the waveguide is approximately equal to 0.5 times the wavelength of the first frequency band.

[0020] In some embodiments, the distance between any two adjacent slots of the waveguide is approximately equal to 0.5 times the wavelength of the first frequency band.

[0021] In some embodiments, the heat dissipation device further includes: a feed section coupled to a signal source, wherein the conductor substrate, the specific heat sink, and the feed section together form a second antenna structure.

[0022] In another preferred embodiment, the present invention provides a heat dissipation device with communication function, comprising: a conductive substrate; a plurality of specific heat sinks coupled to the conductive substrate, wherein each of the specific heat sinks has a notch; a feed portion coupled to a signal source, wherein the conductive substrate, the specific heat sinks, and the feed portion together form an antenna structure; and a tubular element, wherein the notches of the specific heat sinks are used to accommodate the tubular element.

[0023] In some embodiments, the tubular element is made of a non-conductive material.

[0024] In some embodiments, coolant or water can flow within the tubular element.

[0025] In some embodiments, the tubular element is made of a conductive material.

[0026] In some embodiments, the conductor substrate has a feed port excited by a feed waveguide, the feed port being an opening on the conductor substrate, and the feed energy is transmitted from the feed port into the tubular element.

[0027] In some embodiments, the heat dissipation device further includes: an extension structure coupled to one of the open ends of the tubular element.

[0028] In some embodiments, the extension structure is implemented by a horn antenna element.

[0029] In some embodiments, the heat dissipation device further includes: a dielectric lens, wherein the dielectric lens is connected to, embedded in, or covers one of the open ends of the tubular element.

[0030] In some embodiments, the medium lens is classified as a convex lens.

[0031] In some embodiments, the medium lens is classified as a concave lens.

Implementation Method

[0032] In order to make the objectives, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below in conjunction with the accompanying drawings for detailed explanation.

[0033] Certain terms are used in the specification and claims to refer to specific components. Those skilled in the art will understand that hardware manufacturers may use different names to refer to the same component. This specification and claims do not distinguish components by differences in name, but by differences in function. The terms "comprising" and "including" used throughout the specification and claims are open-ended and should be interpreted as "including but not limited to". The term "generally" means that within an acceptable margin of error, those skilled in the art can solve the technical problem and achieve the basic technical effect within a certain margin of error. Furthermore, the term "coupled" in this specification includes any direct and indirect electrical connection means. Therefore, if a first device is described as coupled to a second device, it means that the first device can be directly electrically connected to the second device, or indirectly electrically connected to the second device via other devices or connection means.

[0034] The following disclosure provides many different embodiments or examples to implement the different features of this invention. The following disclosure describes specific examples of the various components and their arrangements for simplification. Of course, these specific examples are not intended to be limiting. For example, if this disclosure describes a first feature formed on or above a second feature, it means that it may include embodiments where the first feature and the second feature are in direct contact, or it may include embodiments where an additional feature is formed between the first feature and the second feature, so that the first feature and the second feature may not be in direct contact. In addition, the same reference numerals and / or markings may be used repeatedly in different examples of the following disclosure. These repetitions are for simplification and clarity and are not intended to limit the specific relationship between the different embodiments and / or structures discussed.

[0035] Furthermore, spatially related terms, such as "below," "below," "lower," "above," "higher," and similar terms, are used to facilitate the description of the relationship between one element or feature in the illustration and another element(s) or feature(s). In addition to the orientation shown in the illustration, these spatially related terms are intended to encompass different orientations of the device in use or operation. The device may be rotated to different orientations (rotated 90 degrees or other orientations), and the spatially related terms used herein can be interpreted in the same way.

[0036] Figure 1A shows a perspective view of a heat dissipation device 100 according to an embodiment of the present invention. Figure 1B shows a cross-sectional view (along a section line LC1) of the heat dissipation device 100 according to an embodiment of the present invention. Please refer to Figures 1A and 1B together. The heat dissipation device 100 can be applied to a mobile device, such as a head-mounted display (HMD), a smartphone, a tablet computer, or a notebook computer. In the embodiments shown in Figures 1A and 1B, the heat dissipation device 100 includes at least: a conductive substrate 110, a first conductive sidewall 121, a second conductive sidewall 122, a plurality of heat sink elements 130, 140, 150, 160, 170, and 180, and a feeding element 190, wherein all of the aforementioned elements may be made of metal. It must be understood that, although not shown in Figures 1A and 1B, the heat dissipation device 100 may further include other elements, such as a connection element and / or a housing.

[0037] The number of heat sinks 130, 140, 150, 160, 170, and 180 is not particularly limited in this invention. In other embodiments, the heat dissipation device 100 may include more or fewer heat sinks. The heat sinks 130, 140, 150, 160, 170, and 180 have different lengths and are all located between the first conductor sidewall 121 and the second conductor sidewall 122. In some embodiments, the lengths of the heat sinks 130, 140, 150, 160, 170, and 180 are all less than or equal to the length of each of the first conductor sidewall 121 and the second conductor sidewall 122. The first conductor sidewall 121, the heat sinks 130, 140, 150, 160, 170, and 180, and the second conductor sidewall 122 are respectively coupled to the conductor substrate 110. The feed section 190, the conductor substrate 110, and the heat sinks 130, 140, 150, 160, 170, and 180 can collectively form an antenna structure. In some embodiments, the aforementioned antenna structure may further include at least one of a first conductor sidewall 121 and a second conductor sidewall 122. That is, the heat dissipation device 100 not only dissipates excess heat but also provides wireless communication functionality.

[0038] The first conductor sidewall 121, the heat sinks 130, 140, 150, 160, 170, 180, and the second conductor sidewall 122 may all be substantially perpendicular to each other with respect to the conductor substrate 110. Furthermore, the first conductor sidewall 121, the heat sinks 130, 140, 150, 160, 170, 180, and the second conductor sidewall 122 may be substantially parallel to each other. For example, any two adjacent first conductor sidewalls 121, the heat sinks 130, 140, 150, 160, 170, 180, and the second conductor sidewall 122 may have substantially equal spacing, but this is not a limitation.

[0039] The feed section 190 is coupled to a signal source 199. For example, the signal source 199 may be a radio frequency (RF) module. The aforementioned antenna structure may be directly excited or coupled excited by the feed section 190. In some embodiments, the feed section 190 may be integrated with the signal source 199 and implemented by a coaxial cable, a microstrip line, or a flexible printed circuit board (FPC).

[0040] In some embodiments, the heat dissipation device 100 further includes a conductive ramp element 123. The conductive ramp element 123 is disposed on the conductive substrate 110 and is used to support and fix the heat sinks 130, 140, 150, 160, 170, and 180, such that the ends 131, 141, 151, 161, 171, and 181 of the heat sinks 130, 140, 150, 160, 170, and 180 can be aligned with each other. For example, the ends 131, 141, 151, 161, 171, and 181 of the heat sinks 130, 140, 150, 160, 170, and 180 can all be located on the same plane E1. In addition, the ends 131, 141, 151, 161, 171, and 181 can also be aligned with the first end 121-T of the first conductor sidewall 121 and the second end 122-T of the second conductor sidewall 122 and located on the same plane E1. Furthermore, the heat sinks 130, 140, 150, 160, 170, and 180 can be coupled to the conductor substrate 110 via the conductor ramp element 123. It must be understood that the conductor ramp element 123 is an optional element. In some embodiments, the conductor ramp element 123 can also be removed, so that the heat sinks 130, 140, 150, 160, 170, and 180 are directly disposed and coupled to the conductor substrate 110.

[0041] Since the heat sinks 130, 140, 150, 160, 170, and 180 have different lengths, the first conductor sidewall 121, the heat sinks 130, 140, 150, 160, 170, and 180, and the second conductor sidewall 122 can collectively define a plurality of open slots 124, 134, 144, 154, 164, 174, and 184 with different lengths. For example, each of the open slots 124, 134, 144, 154, 164, 174, and 184 can each have an open end and a closed end.

[0042] In terms of antenna principle, since the slots 124, 134, 144, 154, 164, 174, and 184 can generate multiple resonant modes at different frequencies, the antenna structure of the heat dissipation device 100 can cover a larger operating bandwidth. Specifically, the slots 124 and 134 with shorter lengths correspond to relatively high-frequency bands, the slots 144, 154, and 164 with medium lengths correspond to relatively mid-frequency bands, and the slots 174 and 184 with longer lengths correspond to relatively low-frequency bands.

[0043] In some embodiments, the aforementioned antenna structure may cover a first frequency band and a second frequency band, wherein the first frequency band may be between 2400MHz and 2500MHz, and the second frequency band may be between 3100MHz and 7125MHz. Therefore, the antenna structure of the heat dissipation device 100 can support broadband operation of traditional WLAN (Wireless Local Area Network) and next-generation 5G communication. Under the design of this invention, the antenna structure for wireless communication can be integrated into the heat dissipation device 100, so its overall device size can be effectively miniaturized.

[0044] Figure 2A shows a perspective view of a heat dissipation device 200 according to an embodiment of the present invention. Figure 2B shows a cross-sectional view of the heat dissipation device 200 according to an embodiment of the present invention (along a section line LC2). Figure 2C shows a cross-sectional view of the heat dissipation device 200 according to an embodiment of the present invention (along another section line LC3). Please refer to Figures 2A, 2B, and 2C together. Figures 2A, 2B, and 2C are similar to Figures 1A and 1B. In the embodiments of Figures 2A, 2B, and 2C, the plurality of heat sinks 230, 240, 250, 260, 270, and 280 of the heat dissipation device 200 each have a plurality of notches 236, 246, 256, 266, 276, and 286. For example, each of the heat sinks 230, 240, 250, 260, 270, and 280 may generally be U-shaped, while each of the notches 236, 246, 256, 266, 276, and 286 may generally be rectangular. The notches 236, 246, 256, 266, 276, and 286 may have different lengths. Specifically, notches 236 and 246 may have shorter lengths, notches 256 and 266 may have intermediate lengths, and notches 276 and 286 may have longer lengths. Furthermore, the notches 236, 246, 256, 266, 276, and 286 may be aligned with each other and generally arranged on the same straight line (e.g., along the direction of section line LC3). However, the invention is not limited to this. In other embodiments, each of the notches 236, 246, 256, 266, 276, and 286 may also be in the form of a semicircle, a triangle, or a square.

[0045] Similarly, the heat sinks 230, 240, 250, 260, 270, and 280 have different lengths and are all located between the first conductor sidewall 121 and the second conductor sidewall 122. The first conductor sidewall 121, the heat sinks 230, 240, 250, 260, 270, and 280, and the second conductor sidewall 122 are respectively coupled to the conductor substrate 110 (e.g., via the conductor ramp element 123). The feed portion 190, the conductor substrate 110, and the heat sinks 230, 240, 250, 260, 270, and 280 can together form an antenna structure. In some embodiments, the aforementioned antenna structure may further include at least one of the first conductor sidewall 121, the second conductor sidewall 122, and the conductor ramp element 123. Since the heat sinks 230, 240, 250, 260, 270, and 280 have different lengths, the first conductor sidewall 121, the heat sinks 230, 240, 250, 260, 270, and 280, and the second conductor sidewall 122 can collectively define a plurality of open slots 224, 234, 244, 254, 264, 274, and 284 with different lengths. Each of the open slots 224, 234, 244, 254, 264, 274, and 284 can each have an open end and a closed end.

[0046] The antenna structure of the heat dissipation device 200 can be directly excited or coupled excited by the feed section 190 and the signal source 199. Figure 3A shows a schematic diagram of the direct excitation mechanism of the antenna structure according to an embodiment of the present invention. In the embodiment of Figure 3A, the feed section 190 is in direct contact with one or more of the heat sinks 230, 240, 250, 260, 270, and 280 (e.g., heat sinks 250 and 260 located in the middle). Figure 3B shows a schematic diagram of the coupling excitation mechanism of the antenna structure according to an embodiment of the present invention. In the embodiment of Figure 3B, the feed section 190 is adjacent to one or more of the heat sinks 230, 240, 250, 260, 270, and 280 (e.g., heat sinks 250 and 260 located in the middle) but is not in direct contact with them. Figure 3C shows a schematic diagram of another direct excitation mechanism of the antenna structure according to an embodiment of the present invention. In the embodiment shown in Figure 3C, the feed section 190 directly contacts only one of the heat sinks 230, 240, 250, 260, 270, and 280 (e.g., the heat sink 250 or 260 located in the middle). In other embodiments, the feed section 190 is not limited to a monopole antenna element, but may be replaced by a dipole antenna element (not shown). It should be noted that the terms "adjacent" or "adjacent" in this specification may refer to a distance between two corresponding elements that is less than a predetermined distance (e.g., 5 mm or less), but generally do not include cases where the two corresponding elements are in direct contact with each other (i.e., the aforementioned distance is shortened to 0). For example, a first coupling gap GC1 may be formed between the feed section 190 and the heat sink 250, and a second coupling gap GC2 may be formed between the feed section 190 and the heat sink 260, but this is not the only possibility. Neither the aforementioned direct excitation mechanism nor the coupled excitation mechanism affects the radiation performance of the antenna structure.

[0047] It should be noted that the notches 236, 246, 256, 266, 276, and 286 arranged on the same straight line can be regarded as a coupling channel, which helps to improve the transfer of electromagnetic energy and improve the operating bandwidth of the antenna structure. In addition, the design of the notches 236, 246, 256, 266, 276, and 286 can also increase the effective resonant length of the heat sinks 230, 240, 250, 260, 270, and 280, so that the size of the antenna structure can be further miniaturized.

[0048] Figure 2D shows the resonant path diagram of the antenna structure of the heat dissipation device 200 according to an embodiment of the present invention. As shown in Figure 2D, the antenna structure of the heat dissipation device 200 may have a low-frequency resonant path PA1, a high-frequency resonant path PA2, and a coupled resonant path PA3. The low-frequency resonant path PA1 may mainly consist of a relatively long heat sink, which corresponds to the aforementioned first frequency band. The high-frequency resonant path PA2 may mainly consist of a relatively short heat sink, which corresponds to the aforementioned second frequency band. The coupled resonant path PA3 can be used to simultaneously fine-tune the impedance matching of the aforementioned first and second frequency bands to optimize the antenna radiation performance.

[0049] The following embodiments will describe different configurations and other structures of the proposed heat dissipation device. It must be understood that these figures and descriptions are merely examples and are not intended to limit the scope of the invention.

[0050] Figure 4A shows a perspective view of a heat dissipation device 400 according to an embodiment of the present invention. Figure 4B shows a bottom view of a heat dissipation device 400 according to an embodiment of the present invention. Figure 4C shows a cross-sectional view (along a section line LC4) of a heat dissipation device 400 according to an embodiment of the present invention. Please refer to Figures 4A, 4B, and 4C together. In the embodiments of Figures 4A, 4B, and 4C, the heat dissipation device 400 includes: a conductive substrate 410, a plurality of general heat sinks 420, 430, 440, and 450, and one or a plurality of specific heat sinks 460, 470, and 480, wherein all the aforementioned components can be made of metal.

[0051] Compared to the foregoing embodiments, the conductor substrate 410 further includes a feeding port 415. For example, the feeding port 415 may be an opening on the conductor substrate 410, which may be excited by a feeding waveguide (not shown). In some embodiments, the feeding port 415 may be located approximately at the center point of the conductor substrate 410, and the feeding port 415 may be adjacent to a specific heat sink 470 in the middle, but is not limited thereto.

[0052] The number of the general heat sinks 420, 430, 440, 450 and the specific heat sinks 460, 470, 480 is not particularly limited in this invention. In practice, the heat dissipation device 400 may include more or fewer general heat sinks or specific heat sinks. In other embodiments, the heat dissipation device 400 may include only a single specific heat sink 470 and two general heat sinks 420, 450. For example, the general heat sinks 420, 430, 440, 450 and the specific heat sinks 460, 470, 480 may all have equal lengths. The general heat sinks 420, 430, 440, 450 are configured and coupled to the conductor substrate 410. These specific heat sinks 460, 470, and 480 are also configured and coupled to the conductor substrate 410, wherein the specific heat sinks 460, 470, and 480 are disposed between the general heat sinks 420, 430, 440, and 450. Specifically, the specific heat sinks 460, 470, and 480 each have a plurality of notches 466, 476, and 486. For example, each of the notches 466, 476, and 486 may generally form an inverted isosceles triangle. Furthermore, the notches 466, 476, and 486 may be aligned with each other and may be generally arranged on the same straight line. In other embodiments, each of the notches 466, 476, and 486 may also form an equilateral triangle, a semicircle, an arc, or a square, but is not limited to these.

[0053] The general heat sinks 420, 430, 440, 450 and the specific heat sinks 460, 470, 480 can all be substantially perpendicular to the conductor substrate 410. Furthermore, the general heat sinks 420, 430, 440, 450 and the specific heat sinks 460, 470, 480 can also be substantially parallel to each other. For example, any two adjacent general heat sinks 420, 430, 440, 450 and the specific heat sinks 460, 470, 480 can have substantially equal distances between them, D1. It must be understood that the terms "general heat sink" and "specific heat sink" both refer to heat sinks; the different names are only used to distinguish their corresponding shapes.

[0054] In some embodiments, the conductor substrate 410 and the specific heat sinks 460, 470, and 480 together form a first antenna structure, enabling the heat dissipation device 400 to also support wireless communication functions. For example, the aforementioned first antenna structure may cover a first frequency band, which may be between 26 GHz and 71 GHz (millimeter wave band, or simply "mmWave"), but is not limited to this.

[0055] In terms of antenna principle, the radiated energy from the feed port 415 of the conductor substrate 410 can be propagated outward through the specific heat sinks 460, 470, and 480. It must be understood that the tapered design of the notches 466, 476, and 486 of the specific heat sinks 460, 470, and 480 helps to reduce non-ideal reflections, thereby improving the radiation efficiency of the aforementioned first antenna structure.

[0056] In some other embodiments, the heat dissipation device 400 further includes a feed 490 coupled to a signal source 499. The conductor substrate 410, the general heat sinks 420, 430, 440, 450, the specific heat sinks 460, 470, 480, and the feed 490 can collectively form a second antenna structure, wherein the aforementioned second antenna structure can be directly excited or coupled excited by the feed 490 (see the embodiments in Figures 3A, 3B, and 3C). In addition, the aforementioned second antenna structure can cover a second frequency band, wherein this second frequency band can be between 2400MHz and 7125MHz. It must be understood that the feed 490 is only an optional element and can be removed in other embodiments.

[0057] In some embodiments, the component dimensions of the heat dissipation device 400 may be as described below. Each of the notches 466, 476, and 486 of the specific heat sinks 460, 470, and 480 may each generally form an inverted isosceles triangle, wherein the length L1 of the base of this isosceles triangle may be between 0.1 and 5 times the wavelength (0.1λ to 5λ) of the first frequency band of the first antenna structure of the heat dissipation device 400, and the height H1 of this isosceles triangle may also be between 0.1 and 5 times the wavelength (0.1λ to 5λ) of the first frequency band of the first antenna structure of the heat dissipation device 400. In addition, the included angle θ between the two legs of the aforementioned isosceles triangle may be less than or equal to 60 degrees (e.g., 40 degrees or 50 degrees). The distance D1 between any two adjacent ordinary heat sinks 420, 430, 440, 450 and specific heat sinks 460, 470, 480 can be less than or equal to 0.25 times the wavelength (λ / 4) of the first frequency band of the first antenna structure of the heat dissipation device 400. The above component dimensions and parameter ranges are derived from multiple experimental results, which help to optimize the operating bandwidth and impedance matching of the first and second antenna structures of the heat dissipation device 400.

[0058] Figure 5 shows a perspective view of a heat dissipation device 500 according to an embodiment of the present invention. In the embodiment of Figure 5, the heat dissipation device 500 includes: a conductive substrate 510, a plurality of specific heat sinks 520, 530, 540, 550, 560, 570, 580, and a waveguide 700, wherein all the aforementioned components can be made of metal.

[0059] The number of the specific heat sinks 520, 530, 540, 550, 560, 570, and 580 is not particularly limited in this invention. In other embodiments, the heat dissipation device 500 may include more or fewer specific heat sinks. For example, the specific heat sinks 520, 530, 540, 550, 560, 570, and 580 may all have equal lengths. The specific heat sinks 520, 530, 540, 550, 560, 570, and 580 are configured and coupled to the conductor substrate 510. In detail, the specific heat sinks 520, 530, 540, 550, 560, 570, and 580 each have a plurality of notches 526, 536, 546, 556, 566, 576, and 586. For example, each of the notches 526, 536, 546, 556, 566, 576, and 586 may be approximately rectangular or square. Furthermore, the notches 526, 536, 546, 556, 566, 576, and 586 may be aligned with each other and may be generally arranged on the same straight line. In other embodiments, each of the notches 526, 536, 546, 556, 566, 576, and 586 may also be semi-circular, arc-shaped, triangular, or trapezoidal.

[0060] These specific heat sinks 520, 530, 540, 550, 560, 570, and 580 may all be substantially perpendicular to each other with respect to the conductor substrate 510. Furthermore, these specific heat sinks 520, 530, 540, 550, 560, 570, and 580 may also be substantially parallel to each other. For example, any two adjacent specific heat sinks 520, 530, 540, 550, 560, 570, and 580 may have substantially equal spacing D2.

[0061] The waveguide 700 has a feed port 710. For example, the feed port 710 may be an end opening of the waveguide 700, which may be excited by another signal source (not shown). A plurality of slots 720, 730, 740 may be formed on the waveguide 700. Similarly, the number of such slots 720, 730, 740 may be adjusted according to different requirements. In some embodiments, each of the slots 720, 730, 740 of the waveguide 700 may each be a closed slot and may be straight, arc-shaped, or meandering, wherein the slots 720, 730, 740 of the waveguide 700 may be generally parallel or aligned with each other, depending on design requirements. Furthermore, the notches 526, 536, 546, 556, 566, 576, and 586 of the specific heat sinks 520, 530, 540, 550, 560, 570, and 580 can be used to accommodate the waveguide 700. In some embodiments, the waveguide 700 is only adjacent to the specific heat sinks 520, 530, 540, 550, 560, 570, and 580, but does not directly contact them. In other embodiments, the shape of the aforementioned notches can be matched with the external shape of the waveguide 700, so that the waveguide 700 can be securely disposed on the specific heat sinks 520, 530, 540, 550, 560, 570, and 580.

[0062] In some embodiments, the waveguide 700 can serve as a first antenna structure, enabling the heat dissipation device 500 to also support wireless communication functions. For example, the aforementioned first antenna structure can cover a first frequency band, which can be between 26 GHz and 71 GHz, but is not limited thereto.

[0063] In terms of antenna principle, the radiated energy from the waveguide 700 can be propagated outward through its slots 720, 730, and 740. It should be noted that the waveguide 700 can be well integrated with the specific heat sinks 520, 530, 540, 550, 560, 570, and 580, thereby miniaturizing the overall size of the heat dissipation device 500.

[0064] In some other embodiments, the heat dissipation device 500 further includes a feed-in section 590 coupled to a signal source 599. The conductor substrate 510, the specific heat sinks 520, 530, 540, 550, 560, 570, 580, and the feed-in section 590 can collectively form a second antenna structure, wherein the aforementioned second antenna structure can be directly excited or coupled excited by the feed-in section 590. In addition, the aforementioned second antenna structure can cover a second frequency band.

[0065] In some embodiments, the component dimensions of the heat dissipation device 500 may be as described below. The length L2 of the feed port 710 of the waveguide 700 may be approximately equal to 0.5 times the wavelength (λ / 2) of the first frequency band of the first antenna structure of the heat dissipation device 500. The length L3 of each of the slots 720, 730, and 740 of the waveguide 700 may each be approximately equal to 0.5 times the wavelength (λ / 2) of the first frequency band of the first antenna structure of the heat dissipation device 500. The distance D2 between any two adjacent heat sinks 520, 530, 540, 550, 560, 570, and 580 may be less than or equal to 0.25 times the wavelength (λ / 4) of the second frequency band of the second antenna structure of the heat dissipation device 500. The distance D3 between any two adjacent slots 720, 730, and 740 of the waveguide 700 can be approximately equal to 0.5 times the wavelength (λ / 2) of the first frequency band of the first antenna structure of the heat dissipation device 500. The above component dimensions and parameter ranges are derived from multiple experimental results, which help to optimize the operating bandwidth and impedance matching of the first and second antenna structures of the heat dissipation device 500.

[0066] Figure 6A shows a perspective view of a heat dissipation device 600 according to an embodiment of the present invention. In the embodiment of Figure 6A, the heat dissipation device 600 includes: a conductive substrate 610, a plurality of specific heat sinks 620, 630, 640, 650, 660, 670, 680, a feed section 690, and a pipeline element 800, wherein the conductive substrate 610, the specific heat sinks 620, 630, 640, 650, 660, 670, 680, and the feed section 690 can all be made of metal, while the pipeline element 800 can be made of a non-conductive material.

[0067] The number of these specific heat sinks 620, 630, 640, 650, 660, 670, and 680 is not particularly limited in this invention. In other embodiments, the heat dissipation device 600 may include more or fewer specific heat sinks. For example, these specific heat sinks 620, 630, 640, 650, 660, 670, and 680 may all have equal lengths. These specific heat sinks 620, 630, 640, 650, 660, 670, and 680 are configured and coupled to the conductor substrate 610. In detail, these specific heat sinks 620, 630, 640, 650, 660, 670, and 680 each have a plurality of notches 626, 636, 646, 656, 666, 676, and 686. For example, each of the notches 626, 636, 646, 656, 666, 676, and 686 may be approximately rectangular or square. Furthermore, the notches 626, 636, 646, 656, 666, 676, and 686 may be aligned with each other and may be generally arranged on the same straight line. In other embodiments, each of the notches 626, 636, 646, 656, 666, 676, and 686 may also be semicircular, arc-shaped, triangular, or trapezoidal.

[0068] These specific heat sinks 620, 630, 640, 650, 660, 670, and 680 may all be substantially perpendicular to each other with respect to the conductor substrate 610. Furthermore, these specific heat sinks 620, 630, 640, 650, 660, 670, and 680 may also be substantially parallel to each other. For example, any two adjacent specific heat sinks 620, 630, 640, 650, 660, 670, and 680 may have substantially equal spacing D4.

[0069] The feed section 690 is coupled to a signal source 699. The conductor substrate 610, the specific heat sinks 620, 630, 640, 650, 660, 670, and 680, and the feed section 690 can together form an antenna structure, wherein the aforementioned antenna structure can be directly excited or coupled-excited by the feed section 690. Therefore, the heat dissipation device 600 can also support wireless communication functions. For example, the aforementioned antenna structure can cover a frequency band, which can be between 2400Hz and 7125Hz, but is not limited to this.

[0070] The notches 626, 636, 646, 656, 666, 676, and 686 of the specific heat sinks 620, 630, 640, 650, 660, 670, and 680 can be used to accommodate the tubular element 800. For example, the tubular element 800 can be in direct contact with the specific heat sinks 620, 630, 640, 650, 660, 670, and 680, but is not limited to this. It should be noted that because the tubular element 800 has a hollow structure, cooling liquid or water (not shown) can flow within the tubular element 800, thereby increasing the heat dissipation effect. According to actual measurement results, the heat dissipation device 600 not only enhances communication quality but also effectively improves its heat dissipation efficiency.

[0071] In some embodiments, the component dimensions of the heat dissipation device 600 may be as described below. The distance D4 between any two adjacent heat sinks 620, 630, 640, 650, 660, 670, and 680 may be less than or equal to 0.25 times the wavelength (λ / 4) of the frequency band of the antenna structure of the heat dissipation device 600. The above component dimensions and component parameter ranges are derived from multiple experimental results, which helps to optimize the operating bandwidth and impedance matching of the antenna structure of the heat dissipation device 600.

[0072] Figure 6B shows a perspective view of a heat dissipation device 601 according to an embodiment of the present invention. Basically, the structure of Figure 6B is generally similar to that of Figure 6A. The heat dissipation device 601 includes: a conductive substrate 610, a plurality of specific heat sinks 620, 630, 640, 650, 660, 670, 680, a feed section 690, and a tubular element 801. The conductive substrate 610, the specific heat sinks 620, 630, 640, 650, 660, 670, 680, and the feed section 690 can all be made of metal, while the tubular element 801 can be made of a conductive material (e.g., a metal waveguide) and has an open end 802 and a closed end (not shown). As shown in Figures 4A and 4B above and their working principle, the conductor substrate 610 may also have a feed port, which can be an opening on the conductor substrate 610 and can be excited by a feed waveguide. Furthermore, the feed energy can be transmitted from this feed port to the tubular element 801, then transferred within the tubular element 801, and finally radiated out from the opening end 802 in the form of an antenna beam. The opening end 802 of the tubular element 801 can be considered as a radiation aperture, and by appropriately adjusting the shape, structure, and material of this radiation aperture, the direction of the aforementioned antenna beam can be changed.

[0073] In the embodiment shown in Figure 6B, the shape of the opening end 802 of the tubular element 801 is the same as that in Figure 6A. It is worth noting that the opening size of the aforementioned radiation aperture can be adjusted according to various antenna design requirements, thereby generating different radiation patterns. Furthermore, Figure 6F shows a partial view of the heat dissipation device 601 according to an embodiment of the present invention. As shown in Figure 6F, one antenna beam 606 of the heat dissipation device 601 is relatively wide.

[0074] Figure 6C shows a partial view of a heat dissipation device 602 according to an embodiment of the present invention (e.g., a perspective view of the heat dissipation device 602 may be shown as in Figure 6G). In the embodiment of Figure 6C, the heat dissipation device 602 further includes an extension structure 804, which can be implemented by a horn antenna element. The extension structure 804 can extend outward to any particular heat sink. For example, the extension structure 804 can be manufactured integrally with the tubular element 801. Alternatively, the extension structure 804 can be manufactured separately and then coupled to the opening end 802 of the tubular element 801. Compared with the embodiment of Figure 6B, the extension structure 804 can provide a larger radiation aperture to the tubular element 801, thereby improving its antenna gain and radiation efficiency. In addition, one of the antenna beams 607 of the heat dissipation device 602 is relatively narrow (compared to the embodiment of Figure 6B), thus resulting in higher directivity.

[0075] Figure 6D shows a partial view of a heat dissipation device 603 according to an embodiment of the present invention. In the embodiment of Figure 6D, the heat dissipation device 603 further includes a dielectric lens 806, wherein the dielectric lens 806 can extend outward to any particular heat sink. For example, the dielectric lens 806 can be connected to, embedded in, or cover the opening end 802 of the tubular element 801. Since the dielectric lens 806 can be classified as a convex lens, one antenna beam 608 of the heat dissipation device 603 will be more focused, thereby improving its antenna gain and radiation efficiency.

[0076] Figure 6E shows a partial view of a heat dissipation device 604 according to an embodiment of the present invention. In the embodiment of Figure 6E, the heat dissipation device 604 further includes a dielectric lens 808, wherein the dielectric lens 808 can extend outward to any particular heat sink. For example, the dielectric lens 808 can be connected to, embedded in, or cover the opening end 802 of the tubular element 801. Since the dielectric lens 808 can be classified as a concave lens, one antenna beam 609 of the heat dissipation device 604 will have a relatively weak center gain and a relatively strong side gain.

[0077] This invention proposes a novel heat dissipation device that integrates a heat sink with an antenna structure. Generally speaking, this invention has advantages such as small size, wide bandwidth, miniaturized overall size, improved communication quality, altered radiation pattern, and / or improved heat dissipation efficiency, making it well-suited for use in various mobile communication devices with limited internal space.

[0078] It is worth noting that the component size, component shape, and frequency range described above are not limiting conditions of the present invention. Antenna designers can adjust these settings according to different needs. The heat dissipation device of the present invention is not limited to the state illustrated in Figures 1-6G. The present invention may include only any one or more features of any one or more embodiments of Figures 1-6G. In other words, not all features illustrated need to be implemented simultaneously in the heat dissipation device of the present invention.

[0079] The ordinal numbers in this specification and the claims, such as "first", "second", "third", etc., have no sequential relationship with each other and are only used to distinguish two different elements with the same name.

[0080] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the scope of the present invention. Anyone skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims. [Simplified Explanation of the Diagram]

[0081] Figure 1A shows a perspective view of the heat dissipation device according to an embodiment of the present invention. Figure 1B shows a cross-sectional view of the heat dissipation device according to an embodiment of the present invention. Figure 2A shows a perspective view of the heat dissipation device according to an embodiment of the present invention. Figure 2B shows a cross-sectional view of the heat dissipation device according to an embodiment of the present invention. Figure 2C shows a cross-sectional view of the heat dissipation device according to an embodiment of the present invention. Figure 2D shows a resonant path diagram of the antenna structure of the heat dissipation device according to an embodiment of the present invention. Figure 3A shows a schematic diagram of the direct excitation mechanism of the antenna structure according to an embodiment of the present invention. Figure 3B shows a schematic diagram of the coupling excitation mechanism of the antenna structure according to an embodiment of the present invention. Figure 3C shows a schematic diagram of another direct excitation mechanism of the antenna structure according to an embodiment of the present invention. Figure 4A shows a perspective view of the heat dissipation device according to an embodiment of the present invention. Figure 4B shows a bottom view of the heat dissipation device according to an embodiment of the present invention. Figure 4C shows a cross-sectional view of the heat dissipation device according to an embodiment of the present invention. Figure 5 shows a perspective view of the heat dissipation device according to an embodiment of the present invention. Figure 6A shows a perspective view of a heat dissipation device according to an embodiment of the present invention. Figure 6B shows a perspective view of a heat dissipation device according to an embodiment of the present invention. Figure 6C shows a partial view of a heat dissipation device according to an embodiment of the present invention. Figure 6D shows a partial view of a heat dissipation device according to an embodiment of the present invention. Figure 6E shows a partial view of a heat dissipation device according to an embodiment of the present invention. Figure 6F shows a partial view of a heat dissipation device according to an embodiment of the present invention. Figure 6G shows a perspective view of a heat dissipation device according to an embodiment of the present invention.

Claims

1. A heat dissipation device with communication function, comprising: A conductor substrate having a feed port; A plurality of ordinary heat sinks are coupled to the conductive substrate; and one or more specific heat sinks coupled to the conductor substrate and disposed between the general heat sinks, wherein each of the specific heat sinks has a notch; wherein the conductor substrate and the specific heat sinks together form a first antenna structure; wherein the feed port is connected to one of the specific heat sinks.

2. The heat dissipation device as claimed in claim 1, wherein the general heat sinks and the specific heat sinks are adjacent to each other and substantially parallel to each other.

3. The heat dissipation device as claimed in claim 1, wherein the notches of the particular heat sinks are generally arranged in a straight line.

4. The heat dissipation device as claimed in claim 1, wherein the first antenna structure covers a first frequency band, and the first frequency band is between 26 GHz and 71 GHz.

5. The heat dissipation device as claimed in claim 4, wherein each of the notches of the particular heat sink is generally in the shape of an inverted isosceles triangle, an equilateral triangle, a semicircle, an arc, or a square.

6. The heat dissipation device as claimed in claim 5, wherein the length of the base of the isosceles triangle is between 0.1 times and 5 times the wavelength of the first frequency band.

7. The heat dissipation device as claimed in claim 5, wherein the height of the isosceles triangle is between 0.1 times and 5 times the wavelength of the first frequency band.

8. The heat dissipation device as claimed in claim 4, wherein the distance between any two adjacent ordinary heat sinks and specific heat sinks is less than or equal to 0.25 times the wavelength of the first frequency band.

9. The heat dissipation device as described in claim 4, further comprising: A feed section is coupled to a signal source, wherein the conductor substrate, the general heat sink, the specific heat sink, and the feed section together form a second antenna structure.

10. The heat dissipation device as claimed in claim 9, wherein the second antenna structure covers a second frequency band, and the second frequency band may be the same as or different from the first frequency band.

11. The heat dissipation device as claimed in claim 1, wherein the feed port is adjacent to the specific heat sink.

12. A heat dissipation device with communication function, comprising: A conductor substrate; A plurality of specific heat sinks are coupled to the conductive substrate, wherein each of the specific heat sinks has a notch; And a waveguide having a feed port, wherein a plurality of slots are formed on the waveguide, and the notches of the particular heat sinks are used to accommodate the waveguide; wherein the waveguide serves as a first antenna structure.

13. The heat dissipation device as described in claim 12, wherein the particular heat sinks are substantially parallel to each other.

14. The heat dissipation device as claimed in claim 12, wherein each of the notches of the particular heat sink is generally rectangular or square.

15. The heat dissipation device as claimed in claim 12, wherein the slots of the waveguide are substantially parallel to each other.

16. The heat dissipation device as claimed in claim 12, wherein the first antenna structure covers a first frequency band, and the length of each of the slots of the waveguide is approximately equal to 0.5 times the wavelength of the first frequency band.

17. The heat dissipation device as claimed in claim 16, wherein the distance between any two adjacent slots of the waveguide is approximately equal to 0.5 times the wavelength of the first frequency band.

18. The heat dissipation device as described in claim 12, further comprising: A feed section is coupled to a signal source, wherein the conductor substrate, the specific heat sink, and the feed section together form a second antenna structure.

19. A heat dissipation device with communication function, comprising: A conductor substrate; A plurality of specific heat sinks coupled to the conductor substrate, wherein each of the specific heat sinks has a notch; a feed section coupled to a signal source, wherein the conductor substrate, the specific heat sinks, and the feed section together form an antenna structure; and a tubular element, wherein the notches of the specific heat sinks are for accommodating the tubular element.

20. The heat dissipation device as claimed in claim 19, wherein the tubular element is made of a non-conductive material.

21. The heat dissipation device as claimed in claim 20, wherein coolant or water can flow within the tubular element.

22. The heat dissipation device as claimed in claim 19, wherein the tubular element is made of a conductive material.

23. The heat dissipation device as claimed in claim 22, wherein the conductor substrate has a feed port excited by a feed waveguide, the feed port being an opening on the conductor substrate, and the feed energy is transmitted from the feed port into the tubular element.

24. The heat dissipation device as described in claim 22 further includes: An extension structure is coupled to one of the open ends of the tubular element.

25. The heat dissipation device as described in claim 24, wherein the extension structure is implemented by a horn antenna element.

26. The heat dissipation device as described in claim 22 further includes: A medium lens, wherein the medium lens is connected to, embedded in, or covers one of the open ends of the tubular element.

27. The heat dissipation device as claimed in claim 26, wherein the dielectric lens is classified as a convex lens.

28. The heat dissipation device as claimed in claim 26, wherein the dielectric lens is classified as a concave lens.

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