Server jet-flow cooling device

Abstract

A server jet-flow cooling device having a server shell and a shunt assembly is provided. The server shell has a motherboard therein and at least one memory module composed by a plurality of memories arranged in interval on the motherboard. An arrangement spacing is arranged between any two adjacent memories. The shunt assembly is arranged in the server shell and includes a shunter and at least one first jet-flow tube communicated to the shunter. The first jet-flow tube is extended from a surface of the shunter, reached in one of the arrangement spacings, and has a first jet located in one of the arrangement spacings to provide positive or negative pressure. A jet flow generated by positive or negative pressure is therefore cooling the memories in the server shell.

Description

[Technical Field]

[0001] This invention relates to a heat dissipation device, and more particularly to a server jet cooling device. [Previous Technology]

[0002] Existing servers often require the addition of multiple memory modules to expand their computing power, and these memory modules are arranged vertically on the motherboard with spacing between them. This causes the heat generated by the memory during operation to accumulate between the gaps and be difficult to dissipate. In particular, the server chassis often contains complex electronic components and other heat dissipation components, and under the surrounding obstruction and configuration, it is even more difficult to dissipate heat simply by blowing air from external sources such as fans.

[0003] In view of the above, the inventors have devoted themselves to research and applied theoretical knowledge to improve and solve the above-mentioned deficiencies, and finally proposed an invention that is reasonably designed and effectively improves the above-mentioned deficiencies. [Summary of the Invention]

[0004] The main objective of this invention is to provide a server jet cooling device that provides heat dissipation for the memory inside the server by using jets generated by positive or negative pressure.

[0005] To achieve the above objectives, the present invention provides a server jet cooling device, comprising a server housing and a distribution assembly; the server housing has a motherboard and at least one memory module disposed on the motherboard, and the memory module is arranged with a plurality of memory modules spaced apart and disposed on the motherboard, such that there is an arrangement spacing between any two adjacent memory modules; the distribution assembly is disposed in the server housing and includes a distributor and at least one first jet pipe communicating with the distributor; wherein the first jet pipe extends from one surface of the distributor and extends into any arrangement spacing, and has a first nozzle located within any arrangement spacing to provide positive pressure or negative pressure.

Implementation Method

[0006] In order to enable your review committee to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are provided for reference and illustration only and are not intended to limit the present invention.

[0007] Please refer to Figures 1, 2, and 3, which are respectively a perspective view, a plan view, and a cross-sectional view of the first embodiment of the present invention. The present invention provides a server jet cooling device, including a server housing 1 and a shunt assembly 2 disposed within the server housing 1. The server housing 1 has a motherboard 1a and at least one memory module 10 disposed on the motherboard 1a, and each memory module 10 is composed of multiple memory modules 10a arranged at intervals on the motherboard 1a. Further, at least one electronic component 11 may be disposed on the motherboard 1a, and the electronic component 11 may be various electronic arithmetic units or arithmetic elements, such as a central processing unit (CPU).

[0008] As described above, the shunt assembly 2 includes a shunt 20 and at least one first jet pipe 21 that communicates with and extends from the shunt 20; further, it may also include at least one second jet pipe 22. The first jet pipe 21 is used to correspond to the memory module 10, while the second jet pipe 22 is used to correspond to the electronic component 11. Specifically, the distributor 20 of the present invention extends in a long strip along the arrangement direction of the memory modules 10a of each memory module 10, and the first jet pipe 21 or the second jet pipe 22 can be disposed and connected to a surface of the distributor 20 facing each memory module 10a. At the same time, the distributor 20 can be supplied with positive or negative pressure through a pressure source (not shown), which can be disposed inside or outside the server housing 1. In the embodiment of the present invention, the distributor 20 is provided with a connecting pipe 23 extending to the outside of the server housing 1 so that the pressure source disposed outside can provide positive or negative pressure to the distributor 20. As shown in FIG1, the connecting pipe 23 protrudes from one end face 1b of the server housing 1 and has an interface 230, which can be connected to the pressure source through the interface 230 by other means such as connecting components or pipes. The end face 1b can also have a ventilation effect, for example, by providing vent holes.

[0009] As shown in Figure 2, any two adjacent memory modules 10a are spaced apart by a spacing S. The first jet pipe 21 extends from one surface of the distributor 20 and extends into any spacing S. It has a first nozzle 210 located within any spacing S. When the pressure source provides positive or negative pressure, the heat generated by each memory module 10a during operation can be discharged from the spacing S. For example, when positive pressure is provided, the heat in the spacing S can be discharged away from the distributor 20 as shown in Figure 2. Or when negative pressure is provided, the heat can be drawn into the distributor 20 from the first nozzle 210, etc., to provide a heat dissipation effect. As shown in Figure 3, in this embodiment, each first jet pipe 21 can be located above each arrangement spacing S, and a wind shield 21a can be further added to the memory module 10; as shown in Figure 3A, each first jet pipe 21 can also be located in the middle or below each arrangement spacing S (figure omitted), or the cross-sectional area of ​​each first jet pipe 21 can be increased and its cross-sectional shape can be matched with the cross-sectional shape of each arrangement spacing S, so as to completely spray positive or negative pressure within the arrangement spacing S, thereby providing its heat dissipation effect.

[0010] Referring again to Figures 2 and 3, the above-mentioned electronic component 11 may be provided with a cooling unit 3. The cooling unit 3 has a plurality of heat sinks 30 attached to the surface of the electronic component 11 and a cover 31 covering each heat sink 30. The cover 31 is provided with vent holes 310. Furthermore, the aforementioned second jet pipe 22 extends from one surface of the distributor 20 and passes through the shield 31, having a second nozzle 220 located within the shield 31. When the pressure source provides positive or negative pressure, the heat generated by the electronic component 11 during operation can be conducted through the heat sink 30, and each heat sink 30 can be discharged by a heat sink plate 300 attached to the electronic component 11. For example, when positive pressure is provided, the second jet pipe 22 discharges the heat on the heat sink 30 through the vent 310 of the shield 31, or when negative pressure is provided, the heat can be drawn into the distributor 20 through the second nozzle 220, thereby providing a heat dissipation effect.

[0011] In other embodiments of the present invention, as shown in Figures 4 to 6, each first jet pipe 21 can be further extended to match the length of each memory 10a, and the first nozzle 210 of each first jet pipe 21 is arranged along its length direction to dissipate heat within each arrangement spacing S. As shown in Figure 6, each first jet pipe 21 can be located above each arrangement spacing S, with its first nozzle 210 located below it; conversely, when the first jet pipe 21 is located below each arrangement spacing S, its first nozzle 210 is located above it. Similarly, as shown in Figure 6A, the first jet pipe 21 can also be located in the middle of each arrangement spacing S, with the first nozzle 210 located both above and below it. In the above embodiments, the cross-sectional area of ​​each first jet pipe 21 is necessarily smaller than the cross-sectional area of ​​each arrangement spacing S.

[0012] In addition, as shown in FIG7, the present invention may further add a fan 24 at a distance from each first jet pipe 21 in the memory module 10. The fan exhausts air into the memory module 10 when the distributor 20 provides positive pressure and blows air into the memory module 10 when the distributor 20 provides negative pressure, thereby assisting the jet to dissipate heat more quickly.

[0013] Therefore, by means of the above-described structure, the server jet cooling device of the present invention can be obtained.

[0014] In summary, the present invention can indeed achieve the purpose of use described in the above specification and solve the deficiencies of the prior art. As it has novelty and progress, it fully meets the requirements for an invention patent application. Therefore, this application is filed in accordance with the Patent Law. Please examine it carefully and grant this patent to protect the rights of the inventor.

[0015] However, the above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, all equivalent techniques and means made using the contents of the present invention specification and drawings are also included in the scope of the present invention and are hereby stated. [Simplified Explanation of the Diagram]

[0016] Figure 1 is a perspective view of the first embodiment of the present invention.

[0017] Figure 2 is a plan view of the first embodiment of the present invention.

[0018] Figure 3 is a cross-sectional schematic diagram of the first embodiment of the present invention.

[0019] Figure 3A is a partial enlarged view based on another modified design of Figure 3.

[0020] Figure 4 is a perspective view of the second embodiment of the present invention.

[0021] Figure 5 is a plan view of the second embodiment of the present invention.

[0022] Figure 6 is a cross-sectional schematic diagram of the second embodiment of the present invention.

[0023] Figure 6A is a partial enlarged view based on another modified design of Figure 6.

[0024] Figure 7 is a perspective view of the third embodiment of the present invention.

Claims

1. A server jet cooling device, comprising: A server chassis includes a motherboard and at least one memory module disposed on the motherboard, wherein the memory module is composed of a plurality of memory cells spaced apart and disposed on the motherboard, such that there is an arrangement spacing between any two adjacent memory cells; and a splitter assembly disposed within the server chassis, including a splitter and at least one first jet pipe communicating with the splitter; wherein the first jet pipe extends from one surface of the splitter and extends into each of the arrangement spacings, and has a first nozzle located within each of the arrangement spacings to provide positive or negative pressure from a pressure source; wherein a wind shield is provided on the memory module.

2. The server jet cooling device as described in claim 1, wherein a fan is provided at the location of the memory module away from the first jet pipe.

3. The server jet cooling device as described in claim 1, wherein the distributor extends in a strip shape along the arrangement direction of each memory in the memory module.

4. The server jet cooling device as described in claim 1, wherein the distributor is provided with a connecting pipe extending to the outside of the server housing and providing the positive pressure or the negative pressure.

5. The server jet cooling device as described in claim 1, wherein the first jet pipe system is located above, below, or in the middle of the arrangement spacing.

6. The server jet cooling device as described in claim 1 or 5, wherein the first jet pipe is configured to extend to match the length of each memory, and the first nozzles are also configured on the first jet pipe along the length of each memory.

7. The server jet cooling device as claimed in claim 1, wherein the motherboard further comprises at least one electronic component, the electronic component is provided with a cooling unit, the cooling unit is covered by a shield covering the electronic component, the shield is provided with vent holes, and the flow distribution assembly further comprises at least one second jet pipe and is disposed toward the electronic component.

8. The server jet cooling device as claimed in claim 7, wherein the cooling unit has a plurality of heat sinks attached to the surface of the electronic component, and the shield covers the heat sinks.

9. The server jet cooling device as described in claim 8, wherein the heat sinks are attached to the surface of the electronic component by a heat sink plate.

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