Coil board and manufacturing method thereof

Abstract

This disclosure provides a coil board and its manufacturing method. The coil board includes a first coil; a first plating layer covering the first coil; a dielectric layer covering the first plating layer; a second coil on the dielectric layer; and a second plating layer covering the second coil. The first plating layer is located between the dielectric layer and the first coil. The dielectric layer includes a first blind via, through which the second coil is electrically connected to the first coil. The coil board further includes a first conductive pad disposed parallel to the first coil and a second conductive pad disposed parallel to the second coil. The dielectric layer also includes a second blind via, through which the second conductive pad is electrically connected to the first conductive pad. The use of the first and second conductive pads achieves the technical effect of electroplating a second plating layer onto an isolated second coil.

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