Bypass flow arrangements for plasma delivery systems, and related processing chambers, flow assemblies, and methods

Abstract

Embodiments of the present disclosure generally relate to semiconductor processing equipment. In one or more embodiments, a flow assembly includes a baffle assembly coupled to a plasma source, the baffle assembly comprising a plurality of baffles and a mixing chamber disposed downstream of the plurality of baffles, and a manifold coupled to the plasma source and the baffle assembly, the manifold comprising a plurality of outlet openings, the plurality of outlet openings of the manifold configured to bypass the plurality of baffles.

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