Plasma treatment equipment and protective components
TW202636493APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information
- Application Number
- TW114143190
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-11-13
- Filing Date
- 2025-11-06
- Publication Date
- 2026-09-01
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Abstract
This invention provides a plasma treatment apparatus and a protective member for suppressing the consumption of a bonding layer. The plasma treatment apparatus of this invention includes: a base disposed within a plasma treatment chamber; an electrostatic chuck disposed on top of the base; a bonding layer disposed between the base and the electrostatic chuck; and a protective member disposed around the bonding layer; wherein the protective member includes: a first annular member surrounding the bonding layer; and a second annular member covering the outer peripheral surface of the first annular member and having a greater strength than the first annular member.
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