Plasma treatment equipment and protective components

TW202636493APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW114143190
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-13
Filing Date
2025-11-06
Publication Date
2026-09-01

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Abstract

This invention provides a plasma treatment apparatus and a protective member for suppressing the consumption of a bonding layer. The plasma treatment apparatus of this invention includes: a base disposed within a plasma treatment chamber; an electrostatic chuck disposed on top of the base; a bonding layer disposed between the base and the electrostatic chuck; and a protective member disposed around the bonding layer; wherein the protective member includes: a first annular member surrounding the bonding layer; and a second annular member covering the outer peripheral surface of the first annular member and having a greater strength than the first annular member.
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