Integrated circuit, semiconductor device, and method of image detection
TW202636661APending Publication Date: 2026-09-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information
- Application Number
- TW114114142
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-21
- Filing Date
- 2025-04-15
- Publication Date
- 2026-09-01
Smart Images
Figure TWG2TA001074157_001 
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Figure TWG2TA001074157_003
Abstract
Temperature control for an image signal processor is provided. An integrated circuit includes a plurality of photodetectors, each electrically coupled with a source follower (SF). The plurality of the SF are electrically coupled with an image signal processor (ISP). The integrated circuit includes a temperature detection circuit thermally coupled with at least one of the SF or the ISP. The integrated circuit includes control circuitry configured to activate a temperature control device (TCD) configured to heat a portion of the ISP. The engagement can be based on a temperature detected by the temperature detection circuit.
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