Wiring circuit board

TW202636701APending Publication Date: 2026-09-01NITTO DENKO CORP
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Patent Information

Application Number
TW114150143
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-27
Filing Date
2025-12-19
Publication Date
2026-09-01

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Abstract

The wiring circuit board (1) has a flexible portion (3A) and a support portion (2A) supporting the flexible portion (3A). The wiring circuit board (1) has a first insulating layer (11), a conductor pattern (12) and a metal support layer (14). The flexible portion (3A) has a portion of the first insulating layer (11), a portion of the conductor pattern (12), a portion of the metal support layer (14), and a resin layer (15) covering the metal support layer (14).
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