Printed Circuit Board Manufacturing Method and Printed Circuit Board

Abstract

A conductive layer with strong adhesion is formed on a substrate made of polyethylene terephthalate using an inkjet printer. The method for manufacturing a printed circuit board 1 includes: a primer printing step, in which a primer liquid is used as ink to form a pattern of a primer layer 3 on a substrate 2 using an inkjet printer; a copper plating step, in which a pattern of a copper microparticle layer 4 is formed on the pattern of the primer layer 3 using an inkjet printer; and a plating step, in which a plating is applied to the copper microparticle layer 4 to form a pattern of a conductive layer 5. The substrate 2 is made of polyethylene terephthalate. The primer liquid contains a polyolefin resin and is wettable to the substrate 2. The softening point of the primer layer 3 is higher than the temperature range of the primer layer 3 during use of the printed circuit board 1, but lower than the heat resistance temperature of the substrate 2. In the copper plating step, the primer layer 3 is heated to a temperature above its softening point and lower than the heat resistance temperature of the substrate 2.

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