Circuit board mounting method and related device
TW202636708APending Publication Date: 2026-09-01HON HAI PRECISION INDUSTRY CO LTD
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Patent Information
- Application Number
- TW114114677
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-18
- Filing Date
- 2025-04-17
- Publication Date
- 2026-09-01
Smart Images
Figure TWG2TA001074167_001 
Figure TWG2TA001074167_002 
Figure TWG2TA001074167_003
Abstract
The present application provides a circuit board mounting method and related devices. The circuit board mounting method includes: obtaining product parameters of a circuit board; forming a plurality of first welding spots on the circuit board based on a plurality of coordinates of the first welding spots, and forming a plurality of second welding spots on the circuit board based on a plurality of coordinates of the second welding spots; recognizing positions of the first welding spots on the circuit board; matching a circuit board coordinate system based on the positions of the first welding spots on the circuit board and the plurality of coordinates of the first welding spots; and mounting the circuit board based on the matched circuit board coordinate system and the coordinates of the second welding spots.
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