Method for the liquid immersion cooling of an electronic component, and immersion cooling apparatus
TW202636726APending Publication Date: 2026-09-01PERSTORP AB
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Patent Information
- Application Number
- TW114144380
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-11-11
- Filing Date
- 2025-11-14
- Publication Date
- 2026-09-01
Abstract
The invention relates to a new and improved method for the liquid immersion cooling of an electronic component with improved sustainability and longevity of the ester fluids used therein as heat transfer fluids.
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