Semiconductor devices

TW202636757APending Publication Date: 2026-09-01KIOXIA CORP
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114130766
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-27
Filing Date
2025-08-12
Publication Date
2026-09-01

Smart Images

  • Figure TWG2TA001074257_001
    Figure TWG2TA001074257_001
  • Figure TWG2TA001074257_002
    Figure TWG2TA001074257_002
  • Figure TWG2TA001074257_003
    Figure TWG2TA001074257_003
Patent Text Reader

Abstract

This invention improves the yield of semiconductor devices. The semiconductor device according to an embodiment includes: a substrate having a surface, and having a first region and a second region disposed such that it surrounds the outer periphery of the first region when viewed along the first direction when the direction perpendicular to the surface is set as a first direction; a semiconductor circuit disposed on the first region of the substrate; a plurality of first conductive pillars arranged separately from each other in a manner surrounding the first region, each of which is located on the second region of the substrate, extends in the first direction, is electrically insulated from each other, and is insulated from the semiconductor circuit; and a passivation film disposed on the first region, overlaps with the semiconductor circuit in the first direction, and when viewed in the first direction, the second region is exposed from the passivation film.
Need to check novelty before this filing date? Find Prior Art