Semiconductor devices
TW202636757APending Publication Date: 2026-09-01KIOXIA CORP
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Patent Information
- Application Number
- TW114130766
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-27
- Filing Date
- 2025-08-12
- Publication Date
- 2026-09-01
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Abstract
This invention improves the yield of semiconductor devices. The semiconductor device according to an embodiment includes: a substrate having a surface, and having a first region and a second region disposed such that it surrounds the outer periphery of the first region when viewed along the first direction when the direction perpendicular to the surface is set as a first direction; a semiconductor circuit disposed on the first region of the substrate; a plurality of first conductive pillars arranged separately from each other in a manner surrounding the first region, each of which is located on the second region of the substrate, extends in the first direction, is electrically insulated from each other, and is insulated from the semiconductor circuit; and a passivation film disposed on the first region, overlaps with the semiconductor circuit in the first direction, and when viewed in the first direction, the second region is exposed from the passivation film.
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