Semiconductor devices and methods of manufacturing thereof

TW202636783APending Publication Date: 2026-09-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114120040
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-04-02
Filing Date
2025-05-28
Publication Date
2026-09-01

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Abstract

A semiconductor device comprises a plurality of nanostructures, a first epitaxial structure, a second epitaxial structure, a gate structure, a plurality of inner spacers, and a plurality of silicon-based cap layers. The plurality of nanostructures can be disposed over and spaced from one another. The first epitaxial structure and a second epitaxial structure can be coupled to ends of each of the plurality of nanostructures, respectively. The gate structure wraps around each of the plurality of nanostructures. Each of the plurality of inner spacers can be interposed between a corresponding section of the gate structure and the first or second epitaxial structure. Each of the silicon-based cap layers can be disposed above or below a corresponding one of the plurality of inner spacers.
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