Gate dielectrics of nanostructure transistors and the methods of forming the same

TW202636797APending Publication Date: 2026-09-01TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114131106
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-06-17
Filing Date
2025-08-14
Publication Date
2026-09-01

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Abstract

A method includes forming a plurality of semiconductor nanostructures comprising a lower semiconductor nanostructure and a topmost semiconductor nanostructure over the lower semiconductor nanostructure, forming interfacial layers contacting the plurality of semiconductor nanostructures, and depositing high-k dielectric layers encircling the interfacial layers. A topmost high-k dielectric layer of the high-k dielectric layers encircling the topmost semiconductor nanostructure includes a topmost horizontal portion overlapping the topmost semiconductor nanostructure, a bottom horizontal portion overlapped by the topmost semiconductor nanostructure, and a sidewall portion on a sidewall of the topmost semiconductor nanostructure. A first one of the topmost horizontal portion, the bottom horizontal portion, and the sidewall portion has a first thickness. A second one of the topmost horizontal portion, the bottom horizontal portion, and the sidewall portion has a second thickness smaller than the first thickness.
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