Integrated sensor package strcuture

Abstract

An integrated sensor package structure is provided. The integrated sensor package structure includes a substrate, a plurality of sensor module disposed on the substrate, and a plurality of optical module disposed on the substrate. Each of the sensor module includes a sensor chip, a frame body surrounding the sensor chip, and a light-permeable member disposed on the frame body. The light-permeable member, the frame body, and the substrate jointly define an enclosed space, and the sensor chip is disposed in the enclosed space. Each of the optical module includes a frame surrounding a corresponding one of the sensor modules and at least one lens mounted on the frame. A thickness of the sensor chip of at least one of the sensor modules is different from a thickness of the sensor chip of another one of the sensor modules.

Description

[Technical Field]

[0001] This invention relates to a sensor packaging structure, and more particularly to an integrated sensor packaging structure. [Previous Technology]

[0002] Generally speaking, in existing sensor packaging structures, multiple different sensor modules are typically packaged individually, and then the packaged sensor modules are combined. However, this approach results in an insufficiently simplified structure in existing sensor packaging structures. [Summary of the Invention]

[0003] This invention discloses an integrated sensor packaging structure, which is mainly used to improve the problem that the existing sensor packaging structure is not simple enough.

[0004] One embodiment of the present invention discloses an integrated sensor packaging structure, comprising: a substrate; a plurality of sensor modules; wherein each of the sensor modules comprises: a sensing chip disposed on the substrate; a frame disposed on the substrate and surrounding the sensing chip; and a light-transmitting element disposed on the frame; wherein the light-transmitting element, the frame, and the substrate together surround to form a closed space, and the sensing chip is disposed in the closed space; and a plurality of optical modules; wherein each of the optical modules comprises: a frame surrounding a corresponding one of the sensor modules; and at least one lens mounted on the frame; wherein the thickness of the sensing chip of at least one of the sensor modules is different from the thickness of the sensing chip of another sensor module.

[0005] An integrated sensor packaging structure includes: a substrate; a plurality of sensor modules; wherein each of the sensor modules includes: a sensing chip disposed on the substrate; a frame disposed on the substrate and surrounding the sensing chip; and a light-transmitting element disposed on the frame; wherein the light-transmitting element, the frame, and the substrate together surround to form a closed space, and the sensing chip is disposed in the closed space; and an optical module; wherein the optical module includes: a frame disposed on the substrate and surrounding the outer periphery of each of the sensor modules, and the frame is integrally formed; and at least one lens mounted on the frame; wherein the thickness of the sensing chip of at least one of the sensor modules is different from the thickness of the sensing chip of another sensor module.

[0006] An integrated sensor packaging structure includes: a substrate; a plurality of sensor chips disposed on the substrate; a light-transmitting element disposed above the plurality of sensor chips; and an optical module including: a frame; wherein the frame includes: a support portion disposed on the substrate and surrounding the plurality of sensor chips and the light-transmitting element; and a plurality of holding portions; wherein each of the holding portions is disposed on the side of the support portion away from the substrate; and a plurality of lenses mounted on the plurality of holding portions of the frame; wherein at least one of the sensor chips has a thickness different from the thickness of another sensor chip.

[0007] In summary, the integrated sensor packaging structure of the present invention can improve the problem of insufficient structural simplification of the existing sensor packaging structure by means of the technical solutions of "multiple sensing chips disposed on the substrate" and "at least one of the sensing chips has a thickness different from that of the other sensing chip".

[0008] To further understand the features and technical content of the present invention, please refer to the following detailed description and drawings of the present invention. However, these descriptions and drawings are only used to illustrate the present invention and are not intended to limit the scope of protection of the present invention in any way.

Implementation Method

[0009] The following specific embodiments illustrate the implementation of the "integrated sensor packaging structure" disclosed in this invention. Those skilled in the art can understand the advantages and effects of this invention from the content disclosed in this specification. This invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this invention. Furthermore, the accompanying drawings of this invention are for simple illustrative purposes only and are not depictions of actual dimensions; this is stated in advance. The following embodiments will further describe the relevant technical content of this invention in detail, but the disclosed content is not intended to limit the scope of protection of this invention.

[0010] It should be understood that although terms such as “first,” “second,” and “third” may be used herein to describe various components or signals, these components or signals should not be limited by these terms. These terms are primarily used to distinguish one component from another, or one signal from another. Furthermore, the term “or” as used herein may, as appropriate, include any combination of one or more of the associated listed items.

[0011] [First Embodiment]

[0012] Please refer to Figures 1 to 3. Figure 1 is a perspective view of the integrated sensor packaging structure according to the first embodiment of the present invention. Figure 2 is an exploded view of the integrated sensor packaging structure according to the first embodiment of the present invention. Figure 3 is a cross-sectional view of Figure 1 along section line III-III. The first embodiment of the present invention provides an integrated sensor packaging structure 100. The integrated sensor packaging structure 100 includes a substrate 1, a plurality of sensor modules 2 disposed on the substrate 1, and a plurality of optical modules 3 disposed on the substrate. Each of the sensor modules 2 may correspond in position to one of the optical modules 3.

[0013] In this embodiment, the substrate 1 may be, for example, a ceramic substrate or a printed circuit board, but the present invention does not limit the material of the substrate 1. The substrate 1 may also be further provided with an electrical connector 11 so that the sensor module 2 can be electrically connected to an electronic component (not shown).

[0014] In this embodiment, the number of multiple sensor modules 2 is three, but the present invention is not limited thereto. For example, in other embodiments not illustrated in the present invention, the number of multiple sensor modules 2 can be two or more. In addition, the multiple sensor modules 2 can be multi-package ball grid array (mPBGA) or plastic leaded chip carrier (PLCC), but the present invention is not limited thereto.

[0015] Each of the sensor modules 2 includes a sensing chip 21, a frame 22, and a light-transmitting element 23. The sensing chip 21 is disposed on the substrate 1, the frame 22 is disposed on the substrate 1 and surrounds the sensing chip 21, and the light-transmitting element 23 is disposed on the frame 22. Specifically, the light-transmitting element 23, the frame 22, and the substrate 1 together form a closed space SP, and the sensing chip 21 is disposed in the closed space SP.

[0016] The sensing chip 21 may be an image sensing chip, but the present invention is not limited thereto. In addition, each of the sensor modules 2 may also include a plurality of wires W, one end of each wire W being connected to the substrate 1, and the other end of each wire W being connected to the sensing chip 21.

[0017] It is worth mentioning that the thickness of the sensing chip 21 of at least one of the sensor modules 2 is different from the thickness of the sensing chip 21 of the other sensor module 2. In this embodiment, the sensing chips 21 of each of the sensor modules 2 have different thicknesses, but the present invention is not limited thereto.

[0018] In other words, in the integrated sensor packaging structure 100 of the present invention, multiple different sensor modules 2 are integrated on the substrate 1 to achieve the effect of simplifying the overall structure, and the multiple sensor modules 2 include multiple sensor chips 21 of different thicknesses so that the integrated sensor packaging structure 100 can adapt to different focusing distances.

[0019] Please refer to Figures 1 to 3 and Figure 4, where Figure 4 is an enlarged schematic diagram of region IV in Figure 3. In each of the sensor modules 2, the frame 22 is annular, and a notch 222 is formed on a top surface 221 of the frame 22, so that the top surface 221 of the frame has a stepped structure S. Specifically, the notch 222 may be annular, and the notch 222 may be formed on the side of the top surface 221 of the frame 22 adjacent to the sensing chip 21 (such as the inner edge of the top surface 221). Furthermore, in each of the sensor modules 2, the frame 22 may be, for example, a molding compound, but the present invention is not limited thereto.

[0020] The light-transmitting element 23 may be, for example, transparent glass, but the present invention is not limited thereto. The light-transmitting element 23 may be disposed on the top surface 221 of the frame 22, and a gap (not labeled) may be formed between the light-transmitting element 23 and the notch 222 of the frame 22.

[0021] Additionally, each of the sensor modules 2 may also include an adhesive layer 24, and the adhesive layer 24 may seamlessly join the notch 222 of the frame 22 and the light-transmitting element 23. The adhesive layer 24 may be the gap located between the light-transmitting element 23 and the notch 222 of the frame 22, so that the light-transmitting element 23 can be adhered to the frame 22 through the adhesive layer 24. Furthermore, the frame 22 of each of the sensor modules 2 may have a flange 223, which is annular and protrudes from the top surface 221 of the frame 22, and the flange 223 surrounds a ring-shaped side surface 231 of the light-transmitting element 23, but the present invention is not limited thereto.

[0022] Each of the optical modules 3 includes a frame 31 surrounding one of the corresponding sensor modules 2 and at least one lens 32 mounted on the frame 31. In this embodiment, each optical module 3 is shown to include three lenses 32, but the invention is not limited thereto. In other embodiments not illustrated in the present invention, the number of lenses 32 included in each optical module 3 may be one, two, or more than three. Furthermore, the frame 31 may be made of, for example, solder resist, ceramic material, or molding compound, but the invention is not limited thereto.

[0023] In each of the optical modules 3, the frame 31 includes a support portion 311 and a retaining portion 312. The support portion 311 is disposed on the substrate 1 and surrounds one of the corresponding sensor modules 2. The retaining portion 312 is located at the end of the support portion 311 away from the substrate 1, and the retaining portion 312 can retain at least one of the lenses 32. In addition, each of the optical modules 3 may also include a lens barrel 33, which is disposed on the retaining portion 312 so that the retaining portion 312 can retain the lens 32 through the lens barrel 33.

[0024] It is worth mentioning that, in each of the sensor modules 2, the thickness of the sensing chip 21 can be positively correlated with the height of the frame 31 of one of the corresponding optical modules 3 (e.g., the distance between the end of the frame 31 away from the substrate 1 and the substrate 1), but the present invention is not limited to this. In other words, in each of the sensor modules 2, the greater the thickness of the sensing chip 21, the greater the height of the frame 31 of the corresponding optical module 3. Accordingly, the greater the thickness of the sensing chip 21, the greater the distance between the lens 32 mounted on the corresponding frame 31 and the sensing chip 21. In other embodiments, the height of the frame 31 can also be varied according to actual needs, and the present invention does not limit this.

[0025] [Second Embodiment]

[0026] Please refer to Figures 5 to 7. Figure 5 is a perspective view of the integrated sensor package structure according to the second embodiment of the present invention. Figure 6 is an exploded view of the integrated sensor package structure according to the second embodiment of the present invention. Figure 7 is a cross-sectional view of Figure 5 along section line VII-VII. The second embodiment of the present invention is similar to the first embodiment of the present invention. The similarities between the two embodiments will not be repeated. The differences between the two embodiments are explained below.

[0027] In this embodiment, the integrated sensor packaging structure 100 may contain only one optical module 3. The frame 31 is disposed on the substrate 1 and surrounds the outer periphery of each of the sensor modules 2, and the frame 31 may be integrally formed.

[0028] Specifically, in the optical module 3, the frame 31 includes a plurality of support portions 311 and a plurality of holding portions 312. Each support portion 311 is disposed on the substrate 1 and surrounds one of the corresponding sensor modules 2. Each holding portion 312 can hold the lens 32. The plurality of support portions 311 and the plurality of holding portions 312 are integrally formed.

[0029] In each of the sensor modules 2, the thickness of the sensing chip 21 is positively correlated with the height of one of the corresponding holding portions 312 of the frame 31 (e.g., the distance between the end of the holding portion 312 away from the substrate 1 and the substrate 1). Accordingly, the greater the thickness of the sensing chip 21, the greater the distance between the lens 32 mounted on the corresponding holding portion 312 and the sensing chip 21.

[0030] [Third Embodiment]

[0031] Please refer to Figure 8, which is a schematic diagram of the integrated sensor packaging structure of the third embodiment of the present invention. The third embodiment of the present invention is similar to the second embodiment of the present invention. The similarities between the two embodiments will not be repeated, while the differences between the two embodiments are explained below.

[0032] In this embodiment, the frame 31 includes one support portion 311 and one frame 22. The support portion 311 surrounds a plurality of sensing chips 21, the light-transmitting element 23 and the frame 22, and the frame 22 surrounds a plurality of sensing chips 21.

[0033] Furthermore, in this embodiment, the number of light-transmitting elements 23 is one, and the light-transmitting element 23 is disposed above the plurality of sensing chips 21. In other words, the projection area formed by the orthographic projection of each of the sensing chips 21 onto the light-transmitting element 23 can be located on the bottom surface of the light-transmitting element 23, and the plurality of sensing chips 21 are disposed in the enclosed space SP. In addition, each of the holding portions 312 is disposed on the side of the support portion 311 away from the substrate 1, and the bottom surface of each of the holding portions 312 of the frame 31 can be directly disposed on the light-transmitting element 23, but the present invention is not limited thereto.

[0034] [Beneficial Effects of the Embodiments]

[0035] The integrated sensor packaging structure of the present invention can improve the problem of insufficient structural simplification of the existing sensor packaging structure by means of the technical solutions of "multiple sensing chips disposed on the substrate" and "at least one of the sensing chips has a thickness different from that of the other sensing chip".

[0036] The above description is only a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Therefore, all equivalent technical changes made based on the description and drawings of the present invention are included within the protection scope of the present invention. [Simplified Explanation of the Diagram]

[0037] Figure 1 is a three-dimensional schematic diagram of the integrated sensor packaging structure of the first embodiment of the present invention.

[0038] Figure 2 is an exploded view of the integrated sensor package structure of the first embodiment of the present invention.

[0039] Figure 3 is a schematic cross-sectional view along section line III-III of Figure 1.

[0040] Figure 4 is an enlarged schematic diagram of region IV in Figure 3.

[0041] Figure 5 is a perspective view of the integrated sensor packaging structure of the second embodiment of the present invention.

[0042] Figure 6 is an exploded view of the integrated sensor package structure of the second embodiment of the present invention.

[0043] Figure 7 is a cross-sectional view along section line VII-VII of Figure 5.

[0044] Figure 8 is a schematic diagram of the integrated sensor packaging structure of the third embodiment of the present invention.

Claims

1. An integrated sensor packaging structure, comprising: a substrate; and multiple sensor modules; wherein, Each of the sensor modules includes: a sensing chip disposed on the substrate; a frame disposed on the substrate and surrounding the sensing chip; and a light-transmitting element disposed on the frame; wherein the light-transmitting element, the frame, and the substrate together enclose a closed space, and the sensing chip is disposed in the closed space; and a plurality of optical modules; wherein each of the optical modules includes: a frame surrounding a corresponding one of the sensor modules; and at least one lens mounted on the frame; wherein the thickness of the sensing chip of at least one of the sensor modules is different from the thickness of the sensing chip of another sensor module.

2. The integrated sensor package structure as described in claim 1, wherein, In each of the sensor modules, a notch is formed on one top surface of the frame, so that the top surface of the frame has a stepped structure.

3. The integrated sensor package structure as described in claim 2, wherein, Each of the sensor modules further includes an adhesive layer, and the adhesive layer seamlessly joins the notch in the frame to the light-transmitting element.

4. The integrated sensor package structure as described in claim 2, wherein, Each of the sensor modules has a frame with a flange portion that is annular and protrudes from the top surface of the frame, and the flange portion surrounds a ring side of the light-transmitting element.

5. The integrated sensor package structure as described in claim 1, wherein, In each of the optical modules, the frame includes a support portion and a retaining portion. The support portion is disposed on the substrate and surrounds one of the corresponding sensor modules, and the retaining portion is capable of retaining at least one of the lenses.

6. The integrated sensor package structure as described in claim 1, wherein, In each of the sensor modules, the thickness of the sensing chip is positively correlated with the height of the frame of one of the corresponding optical modules.

7. An integrated sensor packaging structure, comprising: a substrate; and multiple sensor modules; wherein, Each of the sensor modules includes: a sensing chip disposed on the substrate; a frame disposed on the substrate and surrounding the sensing chip; and a light-transmitting element disposed on the frame; wherein the light-transmitting element, the frame, and the substrate together enclose a closed space, and the sensing chip is disposed in the closed space; and an optical module; wherein the optical module includes: a frame disposed on the substrate and surrounding the outer periphery of each of the sensor modules, and the frame is integrally formed; and at least one lens mounted on the frame; wherein the thickness of the sensing chip of at least one of the sensor modules is different from the thickness of the sensing chip of the other sensor module.

8. The integrated sensor package structure as described in claim 7, wherein, In each of the sensor modules, a notch is formed on one top surface of the frame, so that the top surface of the frame has a stepped structure.

9. The integrated sensor package structure as described in claim 8, wherein, Each of the sensor modules further includes an adhesive layer, and the adhesive layer seamlessly joins the notch in the frame to the light-transmitting element.

10. The integrated sensor package structure as described in claim 8, wherein, Each of the sensor modules has a frame with a flange portion that is annular and protrudes from the top surface of the frame, and the flange portion surrounds a ring side of the light-transmitting element.

11. The integrated sensor package structure as described in claim 7, wherein, In the optical module, the frame includes a plurality of support portions and a plurality of holding portions. Each support portion is disposed on the substrate and surrounds one of the corresponding sensor modules. Each holding portion can hold at least one lens. The plurality of support portions and the plurality of holding portions are integrally formed.

12. The integrated sensor package structure as described in claim 11, wherein, In each of the sensor modules, the thickness of the sensing chip is positively correlated with the height of one of the corresponding holding portions of the frame.

13. An integrated sensor packaging structure, comprising: a substrate; a plurality of sensing chips disposed on the substrate; a light-transmitting element disposed above the plurality of sensing chips; and an optical module comprising: a frame; wherein, The frame includes: a support portion disposed on the substrate and surrounding the plurality of sensing chips and the light-transmitting element; and a plurality of retaining portions, wherein each of the retaining portions is disposed on the side of the support portion away from the substrate; and a plurality of lenses mounted on the plurality of retaining portions of the frame; wherein at least one of the sensing chips has a thickness different from the thickness of another sensing chip.

14. The integrated sensor package structure as claimed in claim 13, further comprising a frame disposed on the substrate and surrounding the plurality of said sensor chips; wherein, The light-transmitting element is disposed on the frame.

15. The integrated sensor package structure as described in claim 14, wherein, A notch is formed on one top surface of the frame so that the top surface of the frame has a stepped structure.

16. The integrated sensor package structure as described in claim 15, wherein, It further includes an adhesive layer, and the adhesive layer seamlessly joins the notch in the frame with the light-transmitting element.

17. The integrated sensor package structure as described in claim 15, wherein, The frame has a flange portion that is annular and protrudes from the top surface of the frame, and the flange portion surrounds a ring side of the light-transmitting element.

18. The integrated sensor package structure as described in claim 13, wherein, The thickness of each of the sensing chips is positively correlated with the height of one of the corresponding holding portions of the frame.

19. The integrated sensor package structure as described in claim 13, wherein, In the optical module, the bottom surface of each of the holding parts of the frame is directly disposed on the light-transmitting element.

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