Integrated sensor package strcuture

Abstract

An integrated sensor package structure is provided. The integrated sensor package structure includes a substrate, a plurality of sensor units, and an encapsulation layer. The substrate has a first surface and a second surface. The sensor units are disposed on the first surface. Each of the sensor units includes a sensor chip disposed on the first surface, a light-permeable member arranged above the sensor chip, and an optical module disposed on a surface of the light-permeable member. The optical module includes a frame disposed on the sensor chip and a lens mounted in the frame. The encapsulation layer surrounds an outer periphery of each of the sensor units. A thickness of the sensor chip of at least one of the sensor units is different from a thickness of the sensor chip of another one of the sensor units.

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