Substrate processing apparatus, heat transfer component, tray, plasma processing apparatus, substrate processing system, and substrate processing method

TW202636867APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114143725
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-07-16
Filing Date
2025-11-10
Publication Date
2026-09-01

Smart Images

  • Figure TWG2TA001074636_001
    Figure TWG2TA001074636_001
  • Figure TWG2TA001074636_002
    Figure TWG2TA001074636_002
  • Figure TWG2TA001074636_003
    Figure TWG2TA001074636_003
Patent Text Reader

Abstract

This invention provides a technique for improving the separability of a heat transfer member from a member in contact with the heat transfer member. This invention also provides a substrate processing apparatus comprising: a chamber; a substrate support disposed within the chamber; and a heat transfer member disposed on the substrate support, and having an adhesive silicon-containing sheet, the upper surface of which is coated with a carbon-containing film.
Need to check novelty before this filing date? Find Prior Art