Substrate processing method and substrate processing apparatus
TW202636873APending Publication Date: 2026-09-01SCREEN HOLDINGS CO LTD
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Patent Information
- Application Number
- TW115105608
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-26
- Filing Date
- 2026-02-12
- Publication Date
- 2026-09-01
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Abstract
This disclosure provides a substrate processing method and apparatus that can homogenize the boundary between surface-treated and untreated areas even when the surface treatment time is extended. The substrate processing method involves spraying a processing liquid onto the outer periphery of a rotating substrate, heat-treating the substrate for a predetermined time to set the substrate to a fully warped state, and then spraying the processing liquid onto the outer periphery of the fully warped substrate.
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