Semiconductor device and methods of formation

Abstract

Semiconductor devices are manufactured on a wafer to include one or more buffer regions that may be used for dicing or cutting the semiconductor devices from the wafer in a die singulation process. The buffer region(s) of a semiconductor device may be located between a scribe line region of the wafer and a seal ring region of the semiconductor device. A laser beam may be used to cut a groove into the buffer region(s) of the semiconductor device as opposed to cutting the groove into the scribe line regions of the wafer. Another laser beam and / or a wafer saw may then be used to cut fully through the scribe line regions to dice or cut the wafer into individual semiconductor devices.

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