Manufacturing method of semiconductor devices and temporary fixing materials for silicon carrier substrates

Abstract

A method for manufacturing a semiconductor device includes: a step of preparing a laminate having a silicon carrier substrate and an organic temporary fixing material laminated on the silicon carrier substrate; a step of temporarily fixing a semiconductor component to a support member via the organic temporary fixing material; a step of processing the semiconductor component temporarily fixed to the support member; and a step of irradiating the organic temporary fixing material of the laminate with light including infrared light from the silicon carrier substrate side to separate the semiconductor component from the support member.

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