System and method for processing substrate

TW202636879APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114138952
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-14
Filing Date
2025-10-09
Publication Date
2026-09-01

Smart Images

  • Figure TWG2TA001074350_001
    Figure TWG2TA001074350_001
  • Figure TWG2TA001074350_002
    Figure TWG2TA001074350_002
  • Figure TWG2TA001074350_003
    Figure TWG2TA001074350_003
Patent Text Reader

Abstract

A method for processing a substrate includes dispensing a processing fluid onto the substrate in a processing chamber from an opening through an upper surface of the processing chamber and displacing the processing fluid in the processing chamber with a dry fluid injected through the opening as a wavefront pulse. The opening is near an edge of the substrate. The dry fluid displaces the processing fluid through a conduit opposite the opening.
Need to check novelty before this filing date? Find Prior Art