substrate cleaning device

TW202636885APending Publication Date: 2026-09-01ACM RES (SHANGHAI) INC +1
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Patent Information

Application Number
TW115106554
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-27
Filing Date
2026-02-24
Publication Date
2026-09-01

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Abstract

This disclosure relates to the field of semiconductor manufacturing, specifically to a substrate cleaning apparatus, comprising: a cleaning tank for accommodating multiple substrates arranged along a first direction; at least two spray cleaning mechanisms disposed on opposite sides within the cleaning tank, wherein each spray cleaning mechanism comprises: a liquid inlet pipe movably disposed within the cleaning tank; at least two nozzles spaced apart along the first direction and communicating with the liquid inlet pipe for spraying cleaning liquid onto the substrate surface; and a first driving assembly connected to the liquid inlet pipe for driving the liquid inlet pipe to rotate to change the spray angle of the at least two nozzles.
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