Plasma treatment equipment, operation method of plasma treatment equipment, inspection equipment and inspection method

Abstract

The purpose of this invention is to provide a technology that enables non-destructive and non-contact evaluation of the condition of components used in a plasma processing apparatus, and to display the evaluation results to the user of the plasma processing apparatus. The plasma processing apparatus of this invention is a plasma processing apparatus having a component with a Y and O film on its surface within a processing chamber that processes wafers using plasma. It includes a control unit that, when the absorption intensity of infrared light of a predetermined wavelength detected from the surface of the film on the aforementioned component becomes extremely low, notifies that damage or wear of the aforementioned film has reached a certain value, or notifies the lifespan of the aforementioned component.

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