An alignment device and method for semiconductor manufacturing equipment; semiconductor manufacturing equipment

Abstract

This invention provides an alignment apparatus and method for semiconductor manufacturing equipment. The alignment apparatus includes a mounting plate and an alignment module. The alignment module includes multiple lens assemblies, at least some of which include a drive mechanism and a lens unit. The drive mechanism is mounted on the mounting plate and connected to the lens unit, and is capable of driving the lens unit to move along a first direction and / or a second direction, the second direction being perpendicular to the first direction. The alignment apparatus is applied to semiconductor manufacturing equipment and can perform an alignment method on a substrate mounted on a workpiece stage of the semiconductor manufacturing equipment. When performing the alignment method, the multiple lens assemblies of the alignment module simultaneously perform alignment operations on multiple alignment marks on an exposure area, resulting in short travel distances and movement times for each lens unit. Furthermore, the alignment time can be shortened and alignment efficiency improved by controlling the simultaneous movement of at least some lens units, thereby increasing the throughput of the semiconductor manufacturing equipment.

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