Substrate support and substrate processing apparatus

TW202636919APending Publication Date: 2026-09-01THE UNIV OF TOKYO +1
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Patent Information

Application Number
TW114142669
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-11
Filing Date
2025-11-03
Publication Date
2026-09-01

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Abstract

A substrate support includes: a fixed-side member; and a movable-side member movable relative to the fixed-side member. The movable-side member has: a first platform having a support surface for supporting the substrate; and a first electrode disposed within the first platform. The fixed-side member has: a second platform disposed below the first platform, forming a gap with the first platform; and a second electrode disposed within the second platform. The first electrode and the second electrode are electrically coupled via an ionic liquid disposed in the gap. The ionic liquid contains conductive microparticles.
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