Substrate processing device

TW202636923APending Publication Date: 2026-09-01SHIBAURA MECHATRONICS CORP
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Patent Information

Application Number
TW115103906
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-27
Filing Date
2026-02-02
Publication Date
2026-09-01

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    Figure TWG2TA001075238_003
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Abstract

The present invention provides a substrate processing apparatus that can improve the circumferential temperature uniformity of a substrate. The substrate processing apparatus (1) of the embodiment includes: a rotation holding section (10) for rotating a substrate (W) held on a holding member (12); a processing liquid supply section (20) for supplying processing liquid (Lp) to the upper surface of the rotating substrate (W); and a heating section (50) for irradiating heating light from above the upper surface of the substrate (W) and transmitting light through at least the portion of the holding member in contact with the substrate (W).
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