Wafer flipping device and wafer cleaning equipment

Abstract

This application discloses a wafer flipping device and a wafer cleaning equipment, pertaining to the field of semiconductor fabrication technology. The disclosed wafer flipping device includes a base, a housing, a first driving unit, and a clamping mechanism. The first driving unit is installed on the base and connected to the housing, so as to drive the housing to flip relative to the base. The clamping mechanism includes a clamping shaft assembly, which is rotatably disposed within an installation space of the housing, and defines an accommodation space within the installation space for holding at least two wafers. The clamping shaft assembly can adjust the size of the accommodation space by means of rotation, thereby clamping or releasing at least two wafers. As a result, flipping operations for at least two wafers can be achieved, improving the efficiency of wafer flipping and, consequently, enhancing the efficiency of wafer cleaning.

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