Inspection apparatus, coupling system and inspection method

Abstract

This invention aims to provide a technique for shortening the inspection time or improving the inspection accuracy of multilayer substrates. The inspection apparatus of this invention inspects a multilayer substrate comprising a target substrate and a bare die bonded to the target substrate. The inspection apparatus includes: a light source; an optical system that illuminates a circular illumination area on the surface of the multilayer substrate with light emitted from the light source; a photodetector that detects reflected light from the illumination area; a driving device that changes the position of the illumination area; and a control circuit that controls the position of the illumination area. The control circuit controls: setting a hexagonal grid comprising a plurality of hexagonal regions of the same size on the surface of the multilayer substrate; and setting the center of the illumination area at the center of each of the hexagonal regions.

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