Substrate processing apparatus, fluid supply system and substrate processing method

TW202636944APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW114140568
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-31
Filing Date
2025-10-21
Publication Date
2026-09-01

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Abstract

A technique is provided to reduce the directional change of fluid flowing to a filter. According to one aspect of the present invention, a substrate processing apparatus is provided that performs substrate drying by replacing a liquid film of a drying liquid formed on the substrate with a supercritical processing fluid; the apparatus comprises: a processing container; and a fluid supply unit for supplying processing fluid into the processing container; the fluid supply unit has: a plurality of first supply lines connected in parallel; and a second supply line connecting the plurality of first supply lines and the processing container; in each of the plurality of first supply lines, starting from the upstream side of the flow of the processing fluid, a heater and a switching valve are sequentially provided; and a filter for capturing and collecting particles contained in the processing fluid is provided in the second supply line.
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