substrate heating device

TW202636951APending Publication Date: 2026-09-01TOKYO ELECTRON LTD
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Patent Information

Application Number
TW114139249
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-25
Filing Date
2025-10-13
Publication Date
2026-09-01

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Abstract

[Problem] A substrate heating device in which both a cooling plate and a heating plate are disposed within a common frame, so that the temperature of the substrate is uniform in its surface. [Solution] A substrate heating device that heats a substrate within a frame, wherein a heating plate for holding and heating the substrate and a cooling plate for holding and cooling the substrate are disposed side by side within the frame; a cover, which is liftable and disposed above the heating plate, covers the heating plate; and a partition member, which separates the substrate transport space between the heating plate and the cooling plate, is disposed on the cover.
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