Photolithographic methods

Abstract

A photolithographic method of forming a tapered via channel in an integrated circuit, IC. The tapered via channel extends through an insulator layer sandwiched between a first conductive layer and a second conductive layer. The insulator layer comprises a photopatternable material. The tapered via channel comprises a lower opening at the boundary between the insulator layer and the first conductive layer and an upper opening at the boundary between the insulator layer and the second conductive layer. The method comprises depositing a layer of the photopatternable material onto the first conductive layer, and exposing the photopatternable material using a photomask comprising a feature corresponding to the upper opening of the tapered via channel. The exposing is arranged to facilitate tapering of the via channel.

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