Manufacture method for a packaging substrate

Abstract

The method of manufacturing a packaging substrate according to a present disclosure manufactures the packaging substrate by including: a preparation step of preparing a base substrate comprising a core layer, a first redistribution layer disposed on the core layer, and a second seed layer disposed on the first redistribution layer; a resist pattern film-forming step of forming a resist pattern film on the second seed layer; and a second conductive layer-forming step of forming a second conductive layer from the second seed layer. The first redistribution layer comprises a first conductive layer and a first insulating layer surrounding at least a portion of the first conductive layer. The first conductive layer comprises a first-1 conductive layer disposed closest to the second seed layer. A ratio of a thickness of the resist pattern film to a thickness of the first-1 conductive layer is

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