Package device

Abstract

A package device includes a substrate, an embedded module, a first and a second circuit structures, an electronic unit, and a connecting element. The embedded module is disposed in an opening of the substrate and comprises embedded components and metal stack layers. First sides of at least two of the embedded components are coplanar, whereas second sides thereof have different heights. The metal stack layers are disposed on the second sides of the embedded components and are electrically connected with corresponding metal stack layers. Sides of the metal stack layers distal to the embedded module are mutually aligned. The first and second circuit structures are respectively disposed on a first and a second surfaces of the substrate and are respectively electrically connected to the embedded components and the metal stack layers. The electronic unit is electrically connected to the first circuit structure. The connecting element is electrically connected to the second circuit structure.

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