Package substrate and fabricating method thereof

Abstract

A package substrate and a fabricating method thereof. The package substrate includes a core layer with at least one through hole penetrating opposite sides of the core layer; plugging material formed on opposite sides of the core layer and walls of the through holes, creating a through via formed by the plugging material on the walls of the through hole corresponding to the through hole; conductive pillars formed in the through via; a wiring layer formed on the plugging material on opposite sides of the core layer and electrically connected to the conductive pillars; and a circuit structure formed on the plugging material and the wiring layer on opposite sides of the core layer and electrically connected to the wiring layer. By forming the wiring layer on the plugging material, the manufacturing costs can be significantly reduced, and it also enables the fabrication of a substrate with high-density wiring layer.

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