glass substrate

Abstract

This invention suppresses the reduction in dimensional accuracy. The glass substrate manufacturing method is a method for manufacturing glass substrates for semiconductor devices, which involves generating a glass master plate, measuring the thickness, thickness deviation, and warpage of the glass master plate, screening glass master plates based on their thickness, cutting the screened glass master plates to generate a plurality of glass substrates, setting a first grinding condition for the glass substrates based on the thickness, thickness deviation, and warpage of the glass master plate, grinding the surface of the glass substrates based on the first grinding condition to generate glass plates, measuring the thickness, thickness deviation, and warpage of the glass plates, screening the glass plates based on their thickness, setting a second grinding condition for the glass plates based on their thickness, thickness deviation, and warpage, grinding the surface of the screened glass plates based on the second grinding condition to generate a rectangular glass substrate with a side length of 300 mm or more and a thickness of 0.5 mm or more.

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