Method for placing bond finger

Abstract

An embodiment of the present disclosure relates to a method for placing bond fingers, which includes receiving information related to a plurality of bond fingers, preprocessing a relative position of the plurality of bond fingers, determining a valid position for a first bond finger among the plurality of bond fingers, and generating a placement result for the plurality of bond fingers.

Description

Technical Field

[0001] This invention relates to a method for placing a bonding pad. Prior Technology

[0002] In wire bonding packaging, the placement and orientation of the bond fingers significantly affect the cost and performance of the packaged chip. Bond fingers are non-rectangular and can rotate at any angle. Furthermore, the placement of bond fingers must strictly adhere to design rules. How to efficiently place bond fingers while ensuring high yield and reliability is the problem this invention aims to solve. Summary of the Invention

[0003] One embodiment of this disclosure relates to a method for placing bonding pads, including receiving information related to a plurality of bonding pads, preprocessing a relative position of the plurality of bonding pads, determining a valid position of a first bonding pad among the plurality of bonding pads, and generating a placement result of the plurality of bonding pads.

[0004] One embodiment of this disclosure relates to a method for placing a bonding pad, including receiving information related to a first bonding pad, simulating a shape of the first bonding pad with a first rectangle and a second rectangle, and determining a valid position of the first bonding pad based on a relative position of the first rectangle and the second rectangle. Simple Explanation of the Diagram

[0005] When read in conjunction with the accompanying drawings, some embodiments of the invention will become readily apparent from the following detailed description. It should be noted that various structures may not be drawn to scale, and the dimensions of various structures may be arbitrarily increased or decreased for clarity of explanation.

[0006] Figure 1 is a flowchart of a method according to some embodiments of the present invention.

[0007] Figure 2A is a schematic diagram of a semiconductor device according to some embodiments of the present invention.

[0008] Figure 2B is a schematic diagram of a bonding pad according to some embodiments of the present invention.

[0009] Figure 2C is a schematic diagram of bonding pads and components according to some embodiments of the present invention.

[0010] Figure 3 is a schematic diagram of a bonding pad and components according to some embodiments of the present invention.

[0011] Figure 4 is a schematic diagram of a bonding pad according to some embodiments of the present invention.

[0012] Figure 5 is a schematic diagram of a bonding pad according to some embodiments of the present invention.

[0013] Figure 6 is a schematic diagram of a bonding pad according to some embodiments of the present invention.

[0014] Figure 7 is a schematic diagram of the inner rectangle of the arrangement according to some embodiments of the present invention.

[0015] Figure 8A is a schematic diagram of the outer rectangle of the arrangement according to some embodiments of the present invention.

[0016] Figure 8B is a schematic diagram of the outer rectangle of the arrangement according to some embodiments of the present invention.

[0017] Figure 8C is a schematic diagram of the outer rectangle of the arrangement according to some embodiments of the present invention.

[0018] Figure 9 is a schematic diagram of the outer rectangle of the arrangement according to some embodiments of the present invention.

[0019] Figure 10 is a schematic diagram of the outer rectangle of the arrangement according to some embodiments of the present invention.

[0020] Figure 11 is a schematic diagram of a bonding pad according to some embodiments of the present invention.

[0021] Figure 12 is a schematic diagram of a bonding pad according to some embodiments of the present invention.

[0022] Figure 13 is a schematic diagram of a bonding pad according to some embodiments of the present invention.

[0023] Figure 14 is a schematic diagram of a bonding pad according to some embodiments of the present invention.

[0024] Figure 15 is a schematic diagram of bonding pads and components according to some embodiments of the present invention.

[0025] Figure 16 is a block diagram of a computer system according to an exemplary embodiment of the present invention. Implementation

[0026] Common element symbols are used throughout the drawings and embodiments to indicate the same or similar components. The following detailed description, which is self-contained and accompanied by the accompanying drawings, will facilitate the understanding of embodiments of the invention.

[0027] The following description provides numerous different embodiments or instances for implementing various features of the provided subject matter. Specific examples of components and configurations are described below to explain certain aspects of the invention. Of course, these components and configurations are merely examples and are not intended to be limiting. For instance, in the following description, the formation of a first feature over or on a second feature may include embodiments where the first and second features are formed or disposed in direct contact, and may also include embodiments where additional features may be formed or disposed between the first and second features such that the first and second features do not need to be in direct contact. Furthermore, the invention may repeat element symbols and / or letters in various instances. This repetition is for simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or configurations discussed.

[0028] Figure 1 is a schematic diagram of method 1 according to some embodiments of the present invention. Method 1 may include a wiring process that can be automatically executed in a semiconductor device manufacturing process. Method 1 may include a method for placing components in a semiconductor device, such as (but not limited to) a method for placing bond fingers in a wire bonding package.

[0029] In the wiring design of semiconductor devices, wire bonding pads can be placed or disposed on a substrate or carrier, and can be placed around components (such as semiconductor components, dies, or wafers). For example, wire bonding pads can be electrically connected to the conductive pads of components via conductive wires, thereby providing an electrical path for the component to other circuits.

[0030] The steps of Method 1 will be explained in detail below.

[0031] Step 10 may include inputting a file. In some embodiments, a user may input a file into the system through an input / output interface (e.g., I / O interface 120 in FIG. 15) so that the system's processor (e.g., processor 121 in FIG. 15) executes the process of method 1. In some embodiments, step 10 may include receiving a file from the system. For example, the system may receive a file through an input / output interface (e.g., I / O interface 120 in FIG. 15).

[0032] In some embodiments, the file may include (but is not limited to) information related to components in a semiconductor device, wiring design constraints and design rules, the process history of the semiconductor device, and / or other instructions or parameters for processor execution.

[0033] For example, the file may include the package of a semiconductor device, the components therein, and / or the corresponding symbols of the I / O contacts, electrical parameters, dimensions, coordinate positions, rotation angles, signal connection relationships, and / or other constraints and design rules for optimizing the placement of the wire bonding pads. For example, referring to Figure 2A, which is a schematic diagram of a semiconductor device according to some embodiments of the present invention, the semiconductor device may include component 20 and conductive pads on component 20. Wire bonding pads are placed around component 20 Connecting conductive pads With the wire pad wires Punch-in pad It can be set within the wire bonding area 21, and the outermost periphery of the semiconductor device may include the packaging area 22.

[0034] Files can be represented by mathematical relationships. For example, a set of conductive pads can... It means that, among them This represents a conductive pad. A set of bonding pads can... It means that, among them This represents a bonding pad. A set of wires can... It means that, among them Represents the connection of conductive pads With the wire pad A wire whose length can express.

[0035] In some embodiments, the file may include (but is not limited to) a bonding pad. Minimum spacing S1 between, punch pad Minimum spacing S2 between component 20 and bonding pad Minimum spacing S3 between the package area 22 and the wire bonding pads in different columns Minimum spacing S4, punch-down pad Rotation angle relative to component 20 1. Punch-in pad Compared to wires rotation angle 2.

[0036] Refer to Figure 2B, which is an enlarged view of region 2b in Figure 2A. (Line-setting pad) The shape can be a rectangle and two semicircles Representation. Rectangle Width and semicircle The diameter is W, and it is a rectangle. The length is h, and the punch pad is... The dimensions are width W and length H, where length H is the sum of length h and width W (i.e., H = h + W). Semicircle The coordinates of the center of the circle are ( ), ( ). Represents the string pad The central axis, which passes through a semicircle The center of the circle. (The rest of the text appears to be a typo and can be left as is.) The coordinates are ( It is semi-circular. coordinates ( )and( ) on the axis The center point on. Representative axis The counterclockwise rotation angle relative to the Y-axis.

[0037] Refer to Figure 2C, which is an enlarged view of region 2c in Figure 2A. For a vertical line passing through and perpendicular to the boundary of element 20, Represents vertical line The counterclockwise rotation angle relative to the Y-axis. Represents the use of conductive pads With the wire pad The vector at the center of . Represents the string pad Compared to wires The counterclockwise rotation angle. Represents wires Relative to vertical line The counterclockwise rotation angle. Therefore, in Figure 2B For Figure 2C , and The sum of .

[0038] In some embodiments, the file may include (but is not limited to) the bonding pads shown in Figures 2B and 2C above. The dimensions, coordinate positions, rotation angles, etc. In some embodiments, one objective of this disclosure is to automatically generate the position and rotation angle of a set of bonding pads F given the component position, package area, set of conductive pads P and set of wires N, by inputting constraints and design rules.

[0039] In some embodiments, one objective of this disclosure is to minimize the total length of the wires (expressed as a mathematical formula). and / or minimize the counterclockwise rotation angle of the bonding pad relative to the wire (expressed as a mathematical formula). ).

[0040] Step 11 may include preprocessing. In some embodiments, step 11 may include preprocessing the relative positions of the bonding pads. In some embodiments, step 11 may include maintaining the order of the bonding pads so that they do not overlap, and / or maintaining a minimum spacing between the bonding pads.

[0041] For example, as shown in Figure 3, which is a schematic diagram of bonding pads and components according to some embodiments of the present invention.

[0042] At the initial position, each bonding pad central axis Parallel to vertical line To allow space for each bonding pad The distance between them is to facilitate further optimization of the placement of the bonding pads in subsequent steps. Step 11 may include placing the bonding pads... Move along the boundary of element 20, for example, along a line perpendicular to the vertical. The direction of movement. In some embodiments, maintaining the non-interleaving order between the bonding pads may include moving the bonding pads in a certain direction. With the wire pad Configure simulated wires (pseudo net) .

[0043] In some embodiments, maintaining a minimum spacing between bonding pads may include expanding the bonding pads. The width. For example, as shown in Figure 4, which is a schematic diagram of a bonding pad according to some embodiments of the present invention. If the bonding pad The width is W, and the punch-down pad is... If the minimum spacing between them is S1, then the bonding pad will be... Expanding to both sides (e.g., expanding to approximately equal distances on both sides) makes the bonding pad... The expansion width is D, where the expansion width D is the sum of the width W and the minimum spacing S1 (i.e., D = W + S1).

[0044] In some embodiments, while maintaining the order between the bonding pads and eliminating overlap between bonding pads, that is, maintaining the individual bonding pads in the bonding pad F. The relative positions are determined, and overlaps are eliminated with the minimum total movement distance.

[0045] Step 12 may include global placement. In some embodiments, as shown in FIG5, FIG5 is a schematic diagram of bonding pads according to some embodiments of the present invention. Step 12 may include dividing the bonding area 21 into a plurality of sub-regions, and according to each bonding pad The shape and area of ​​each bonding pad are used to establish a simulated electric field. All are considered to carry a positive charge, causing them to repel each other with a positive charge. In some embodiments, in the established simulated electric field, the positive charge repulsion forces induced from different directions affect each bonding pad. The force M is generated, causing each bonding pad to move. Evenly distributed. In some embodiments, the degree of dispersion of the bonding pad can also be determined by the area of ​​the sub-region. For example, the larger the area of ​​the sub-region, the greater the moving force M, and the greater the degree of dispersion. However, this disclosure is not limited to this; in some embodiments, the smaller the area of ​​the sub-region, the greater the moving force M, and the greater the degree of dispersion. In some embodiments, minimizing the total length of the wires (expressed as a mathematical formula) can be considered in the global placement step. The counterclockwise rotation angle of the bonding pad relative to the wire (expressed as a mathematical formula) and the bonding pad's rotation angle relative to the wire. ).

[0046] Step 13 may include legalization. In some embodiments, step 13 may include determining the individual bonding pads. The legal position. In some embodiments, step 13 may include determining the individual bonding pads. The legal coordinates and legal angles.

[0047] In some embodiments, step 13 may include placing the individual bonding pads. The shape is simulated as a double rectangle. For example, as shown in Figure 6, Figure 6 is a schematic diagram of a bonding pad according to some embodiments of the present invention. Bonding Pad The shape can be rectangular (or inner rectangle, first rectangle) and rectangle (Also known as the outer rectangle or second rectangle) represents or builds the model. Rectangle It can be placed closer to the component (e.g., component 20 in Figure 2A), rectangular It can be placed relatively far away from the component. Wire bonding pad It can have an expanded width D. Rectangle The center is located in a semi-circle The center coordinates of the circle ( ), ( ), and rectangle The distance between them is the length h.

[0048] In some embodiments, the double-rectangle simulation can also be applied in step 12 to calculate each bonding pad. The area.

[0049] Step 13 may include determining the position of the inner rectangle and the position of the outer rectangle. In some embodiments, step 13 may include alternately determining the individual bonding pads. The inner and outer rectangular positions. For example, for a bonding pad. First decide on the pad for the pinout. rectangle The location will then determine the placement of the injection pad. rectangle The position, and then the wire pad. Decide on the line pad rectangle The position of the (or inner rectangle, third rectangle) is then determined to determine the line pad. rectangle The positions of the rectangles (or inner rectangles, fourth rectangles) can be determined in the following order: first rectangle, second rectangle, third rectangle, fourth rectangle.

[0050] In some embodiments, step 13 may include first determining each bonding pad. The positions of all inner rectangles are then determined, and the individual punch-down pads are then positioned accordingly. The positions of all outer rectangles. For example, first determine the positions of each bonding pad. rectangle The position of each bonding pad is then determined. rectangle The positions. For example, the positions can be determined in the following order: first rectangle, third rectangle, second rectangle, fourth rectangle.

[0051] Step 13 may include arranging each stitching pad using a corner stitching data structure. For example, after placing a rectangle, its boundary is decomposed into a series of "corners" or "edges," and these corners are used to build a connected mesh structure, which includes placed tiles and empty tiles. Each rectangle can only be placed in a corner of an empty tile and does not overlap with other placed tiles. In some embodiments, to maintain the result of global placement, the rectangle is placed at the position with the smallest offset compared to global placement.

[0052] In some embodiments, determine the rectangle The position may include that of a rectangle The rectangle will be positioned relative to the component (component 20 in Figure 2A). Categorization. For example, categorizing rectangles. Divided into four categories or groups, each located on one side of the component. Each category has a rectangle. The position can be determined independently through the legalization process. Within each type of rectangle... In the position legalization step, according to the rectangle The distance between each rectangle and the center point of the element is calculated. The legalization of [the law / regulation].

[0053] In some embodiments, determine the rectangle The position will not change the Y-axis coordinate. For example, as shown in Figure 7, which is a schematic diagram of the inner rectangle of the arrangement according to some embodiments of the present invention.

[0054] rectangle Its position has been determined. Within the rectangle. Rectangle placed on the right At that time, if +D is not less than or equal to , indicating the punch-down pad The elements cannot be separated by an expanded width D; they must be separated by a rectangle. The auxiliary space tile is placed on the right. In some embodiments, an empty grid The width is 1 and the height is a rectangle The top of the rectangle The difference between the bottoms (expressed as a mathematical formula) + -( - )).rectangle Can be placed in an empty grid The corner, such as corner k1 or corner k2.

[0055] In some embodiments, determine the rectangle The position may include that of a rectangle The rectangle will be positioned relative to the component (component 20 in Figure 2A). Categorization. For example, categorizing rectangles. Divided into four categories or groups, each located on one side of the component. Each category has a rectangle. The position can be determined independently through the legalization process. Within each type of rectangle... In the position legalization step, according to the rectangle The distance between each rectangle and the center point of the element is calculated. The legalization of [the law / regulation].

[0056] In some embodiments, the first rectangle The position can be minimized by the counterclockwise rotation angle. (i.e., the punch-down pad) Compared to wires The counterclockwise rotation angle is determined by this. Next, the bonding pad... rectangle The position can be determined by the adjacent punch pad. rectangle and rectangle , and its own rectangle The decision has been made.

[0057] For example, as shown in Figures 8A, 8B, and 8C, Figures 8A, 8B, and 8C are schematic diagrams of the placement of an outer rectangle according to some embodiments of the present invention.

[0058] Represented by rectangle With rectangle The vector at the center, Representative vector Relative to vertical line The counterclockwise rotation angle. Represents a rectangle Not with rectangle Coincident rotation angles Represents a rectangle Not with rectangle Coincident rotation angles.

[0059] Represents an outer rectangle The legal rotation angle is the rotation angle. With rotation angle The set of (expressed in mathematical terms) = ). Finding the legal rotation angle Then, select the vector that minimizes it. Relative to vector (i.e., through conductive pads) With rectangle The angle of counterclockwise rotation of the center vector of the rectangle determines the rectangle. The rotation angle. Due to the wire bonding pad The position is yet to be determined, in vector form. Approximation vector .

[0060] In some embodiments, a rectangle With rectangle The distance between them can Indicates, assuming Represents a rectangle With rectangle Distance on the X-axis Represents a rectangle With rectangle Distance on the Y-axis. Rotation angle. The decision can be expressed in the following statement: [if] [then] [else] [if] [then] [else]

[0061] As shown in Figure 9, Figure 9(a) shows the distance. Case 1 Figure 9(b) shows the maximum rotation angle in case one. Figure 9(c) shows the distance. Case 2 and Figure 9(d) shows the maximum rotation angle in case two. Figure 9(e) shows the distance. Situation 3 and Figure 9(f) shows the maximum rotation angle in case three. .

[0062] In some embodiments, it is assumed Represents a rectangle With rectangle Distance on the X-axis, rotation angle The decision can be expressed in the following statement: [if] [then] [else]

[0063] In distance Situation 4 The maximum rotation angle is .

[0064] As shown in Figure 10, Figure 10(a) shows the distance. Situation 5 Figure 10(b) shows the maximum rotation angle in case five. .

[0065] In some embodiments, in addition to using a double-rectangle model with a corner braided data structure for legalization, step 13 may also include applying the Abacus algorithm. The Abacus algorithm is used to place standard logic gates (cells) in legal positions. According to the X coordinates of the standard logic gates, they are sequentially inserted into the horizontal rows of the placement area. Under the premise that the standard logic gates do not overlap, it can efficiently calculate the placement positions of the standard logic gates and minimize the square of the displacement of all elements in the horizontal row after legalization (expressed as a mathematical formula). ).

[0066] To apply the Abacus algorithm to the placement of bonding pads, step 13 includes placing each bonding pad... Converted into a rectangular virtual cell. Its width is .width From virtual components Virtual elements in front, back, left, or right and The decision must satisfy the condition that the virtual element... , and When placing items close together, use a stitching pad. Front and back or left and right stitching pads and It does not violate constraints and design rules, such as avoiding overlap.

[0067] As shown in Figure 11, Figure 11(a) depicts the stitching pad. Front and back or left and right stitching pads and In Figure 11(b), For punch pads To the wire pad Move horizontally until it contacts the bonding pad. But the first contact point that does not overlap with it, For punch pads To the wire pad Move horizontally until it contacts the bonding pad. However, the first contact point does not overlap with it. In Figure 11(c), the two contact points... and The distance between them determines the width .

[0068] The following will explain how to calculate the bonding pad. With contact point The distance in the X direction (i.e.) - According to the bonding pad and The relative positions can be divided into four forms:

[0069] Form 1: When and ,but - = + As shown in Figure 12, in Figure 12(a), the punch-down pad... By rectangle With semicircle and simulation. Rectangle Middle near the string pad The upper vertex, Rectangle Middle near the string pad The lower vertex. For line segments The slope. It is semi-circular The slope of the upper tangent is The point of tangency. In Figure 12(b), when the upper vertex... At the top Above, further consideration of the tangent point. With the top vertex The relative position of the tangent point. At the top Above indicates the placement of the bonding pad. To the line pad After horizontal displacement, the contact point It will be located in a semi-circle and At the point of tangency. In Figures 12(c) and 12(d), in order to calculate According to the Pythagorean theorem, the equation can be obtained. = It can be known that = , A translated semicircle The X coordinates of [the triangle]. According to the similar triangle theorem, and semicircle The horizontal distance is half the length of the horizontal edge. Ultimately, it will... + Substituting into the above formula, we can obtain the answer. - = + .

[0070] Form 2: When and ,but - = + Form 2 is similar to Form 1, the difference being the semi-circle. Higher than semicircle .

[0071] Form 3: When and ,but - = + As shown in Figure 13, in Figure 13(a), when the tangent point... At the top Below indicates the placement of the bonding pad. To the line pad After horizontal displacement, line segment It will contact the semi-circle In Figure 13(b), according to the Pythagorean theorem, the equation can be obtained. = In addition, line segments The slope is , and semicircle From the center of the circle to the contact point line segments The slopes of the equations are perpendicular to each other, and their product is -1, resulting in the equation. Solving the two simultaneous equations yields... - = + .

[0072] Form 4: When and ,but - = As shown in Figure 14, in Figure 14(a), when the tangent point... At the top Above indicates the placement of the bonding pad. To the line pad After horizontal displacement, the semicircle Contact line segment In Figure 14(b), according to the Pythagorean theorem, the equation can be obtained. = In addition, line segments The slope is , and semicircle From the center of the circle to the contact point line segments The slopes of the equations are perpendicular to each other, and their product is -1, resulting in the equation. Solving the two simultaneous equations yields... .Will Substitute line segment The equation of the straight line and will by + Substitution can yield the result. - = .

[0073] Step 14 may include post-optimization. In some embodiments, post-optimization includes adjusting the individual bonding pads. The position is adjusted to minimize the counterclockwise rotation angle of the bonding pad relative to the wire. As shown in Figure 15, after optimization, the counterclockwise rotation angle... and They all become smaller. In some embodiments, the order of post-optimization can be based on the bonding pad. The distance between the boundary of element 20 and the boundary is determined.

[0074] Step 15 may include outputting results. In some embodiments, placement results, layout, or routing may be output through an I / O interface (e.g., I / O interface 120 in FIG15). In some embodiments, placement results may be presented in the form of a graphical user interface (GUI), code, a plan view of the package structure, etc.

[0075] In some embodiments, when the bonding pads have two rows, Method 1 may further include determining the row of bonding pads before step 11, for example, dividing the bonding pads on one side of the component into two rows, including an inner row and an outer row. The validation of Method 1 may process the position of the inner row of bonding pads first, and then process the position of the outer row of bonding pads. The validation of the position of the inner row of bonding pads can be performed using a double rectangle model combined with a corner braided data structure, or using the Abacus algorithm. The validation of the position of the outer row of bonding pads also needs to consider avoiding wire crossings. If the outer row of bonding pads cannot be validated, the position of the inner row of bonding pads is adjusted again.

[0076] In some embodiments, the placement result can minimize the total length of the wires (expressed as a mathematical formula). The counterclockwise rotation angle of the bonding pad relative to the wire (expressed as a mathematical formula) and the bonding pad's rotation angle relative to the wire. ).

[0077] This disclosure proposes a method or model for determining the position and rotation angle of the bonding pads, for example, simulating the position and rotation angle of the bonding pads using a bicornuate model. When design conditions and requirements are input, the system can automatically calculate and obtain optimized results, reducing product design time. Experimental results show that this invention can reduce computation time by more than 60%, shorten the total signal concatenation path by 50%, and reduce signal interleaving by 50%.

[0078] The various techniques and processes disclosed herein can be used to improve the operation and processing of electronic design automation (EDA) software and related systems.

[0079] Figure 16 is a block diagram of a placement system 2 according to some embodiments of the present invention. The placement system 2 may include an I / O interface 120, a processor 121, a network interface 122, a memory 124, and a bus 125.

[0080] In some embodiments, the I / O interface 120 may be connected to external circuitry. In some embodiments, the placement system 2 may be configured to receive files through the I / O interface 120. As mentioned above, files received through the I / O interface 120 may include (but are not limited to) information related to components in a semiconductor device, wiring design constraints and design rules, the process history of the semiconductor device, and / or other instructions or parameters for processor execution. Files may be transferred to the processor 121 via bus 125. Files may be stored in memory 124. In some embodiments, the I / O interface 120 may include elements such as a keyboard, mouse, trackball, touchpad, and / or cursor for transmitting messages and commands to the processor 121.

[0081] In some embodiments, processor 121 may be configured to execute instructions (referred to as computer program code) encoded in memory 124, enabling processor 121 to perform some or all of the methods 1 disclosed herein. In some embodiments, processor 121 may include a central processing unit (CPU), a multiprocessor, a distributed processing system, an application-specific integrated circuit (ASIC), and / or a suitable processing unit. Processor 121 may be embodied as a standalone chip or as a discrete integrated circuit.

[0082] In some embodiments, network interface 122 can be connected to processor 121 via bus 125. Network interface 122 enables system 2 to communicate with a network that connects to one or more other computer systems. Network interface 122 may include a wireless network interface, such as Bluetooth, Wi-Fi, WiMAX, GPRS, or WCDMA; it may also include a wired network interface, such as Ethernet, USB, or IEEE-1364.

[0083] In some embodiments, memory (which may be referred to as a non-transitory computer-readable storage medium) 124 may store instructions or computer program code. In some embodiments, memory 124 may include semiconductor or solid-state memory, magnetic tape, removable computer floppy disk, random access memory (RAM), read-only memory (ROM), hard disk, and / or optical disc. In one or more embodiments using optical discs, memory 64 may include a read-only optical disc (CD-ROM), a read-write optical disc (CD-R / W), and / or a digital video disc (DVD).

[0084] Each function mentioned in the specification or diagrams may be implemented as instruction logic (e.g., as instructions stored on a non-transitory machine-readable medium), hardware logic, or a combination of both, depending on the implementation method or specific design. Each function mentioned in the specification or diagrams may be stored and / or executed by a single computer or processor; otherwise, it may be stored and / or executed in a distributed manner, for example, using one or more servers, client devices, or application-specific devices, whether they are located in the same location or far apart from each other.

[0085] In some embodiments, a computer program product is provided, including a computer-readable medium having instructions that, when executed by a computer system, are configured to cause the computer system to perform some or all of the operations described herein.

[0086] Unless otherwise specified, spatial descriptions such as "above," "below," "upper," "left," "right," "lower," "top," "bottom," "vertical," "horizontal," "side," "higher," "lower," "upper part," "above," and "below" are used to indicate directions relative to those shown in the figures. It should be understood that the spatial descriptive terms used herein are for illustrative purposes only, and the actual implementation of the structures described herein can be spatially configured in any orientation or manner, provided that the advantages of the embodiments of the invention are not deviated from by such configuration.

[0087] As used herein, the terms "approximately," "substantially," "basically," "about," and "approximately" are used to describe and explain minor variations. When used in conjunction with an event or situation, these terms may refer to instances where the event or situation occurred precisely or instances where the event or situation is very close to occurring. For example, when used in conjunction with numerical values, these terms may refer to a range of variation less than or equal to ±10% of that value, such as a range of variation less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, or less than or equal to ±0.05%. For example, if the first value is within ±10% of the second value, such as ±5%, ±4%, ±3%, ±2%, ±1%, ±0.5%, ±0.1%, or ±0.05%, then the first value can be considered "substantially" the same as or equal to the second value. For example, "substantially" perpendicular can refer to an angle variation of less than or equal to ±10° relative to 90°, such as ±5°, ±4°, ±3°, ±2°, ±1°, ±0.5°, ±0.1°, or ±0.05°.

[0088] If the displacement between two surfaces is no greater than 5 µm, 2 µm, 1 µm, or 0.5 µm, then the two surfaces can be considered coplanar or substantially coplanar. If the displacement between the highest and lowest points of a surface is no greater than 5 µm, 2 µm, 1 µm, or 0.5 µm, then the surface can be considered substantially flat.

[0089] Unless the context clearly indicates otherwise, as used herein, the singular terms “a” and “the” may include a plural indicator.

[0090] As used herein, the terms "conductive," "electrically conductive," and "conductivity" refer to the ability to conduct electric current. A conductive material is generally defined as a material that exhibits minimal or no resistance to the flow of electric current. One unit of measurement for conductivity is Siemens per meter (S / m). Typically, a conductive material is one with a conductivity greater than approximately 10⁴ S / m (e.g., at least 10⁵ S / m or at least 10⁶ S / m). The conductivity of a material can sometimes vary with temperature. Unless otherwise specified, the conductivity of a material is measured at room temperature.

[0091] In addition, quantities, ratios and other values ​​are sometimes presented in range format in this document. It should be understood that such range format is used for convenience and brevity, and should be flexibly interpreted as including not only the values ​​explicitly specified as range limits, but also all individual values ​​or subranges covered within that range, as if each value and subrange were explicitly specified.

[0092] While the invention has been described and illustrated with reference to its specific configuration, such description and illustration are not restrictive. Those skilled in the art will understand that various changes and equivalent substitutions can be made without departing from the true spirit and scope of the invention as defined by the appended claims. The drawings may not be drawn to scale. Due to manufacturing processes and tolerances, there may be differences between the process reproduction in this invention and actual equipment. Other embodiments of the invention may exist that are not specifically described. The specification and drawings should be considered illustrative, not restrictive. Modifications can be made to adapt specific circumstances, materials, compositions, methods, or processes to the objectives, spirit, and scope of the invention. All such modifications are considered to be included within the scope of the appended claims. Although the disclosed methods have been described herein with reference to specific operations performed in a particular order, it should be understood that these operations can be combined, subdivided, or rearranged to form equivalent methods without departing from the teachings of the invention. Therefore, unless specifically indicated herein, the order and grouping of operations are not limitations of the invention.

[0093] 1: Method 2: Placement System 2b, 2c: Areas 10: Steps 11: Steps 12: Steps 13: Steps 14: Steps 15: Steps 20: Components 21: Stringing area 22: Packaging area 120:I / O interface 121: Processor 122: Network Interface 124: Memory 125: Busbar central axis : Lower vertex Semicircle D: Expansion Width : Punch-in pad H, h: Length k1, k2: Corners :Tangent :length M: Mobility Slope :electric wire Conductive pad :vector , :rectangle :vector S1, S2, S3, S4: Minimum Spacing Top vertex W: Width , :coordinate Y: Y-axis Empty grid 1, 2, , Rotation angle :distance Vertical line Contact point

Claims

1. A method for placing bonding pads, comprising: receiving information related to a plurality of bonding pads; pre-processing a relative position of the plurality of bonding pads; determining a valid position of a first bonding pad among the plurality of bonding pads; and generating a placement result of the plurality of bonding pads, wherein pre-processing the relative position of the plurality of bonding pads includes: Maintain the order of the string placement mats so that they do not overlap.

2. The placement method of the bonding pads as described in Request 1, wherein maintaining the order of the bonding pads from being interleaved includes: The plurality of bonding pads are moved along a boundary of an element.

3. The placement method of the bonding pads as described in Request 1, wherein maintaining the order of the bonding pads from being interleaved includes: Expand the size of each of the plurality of bonding pads.

4. The method of placing the bonding pad as described in claim 1 further includes: A simulated electric field is established to generate a moving force that causes the plurality of bonding pads to spread out evenly from each other.

5. As in the method for placing the bonding pad in claim 1, determining the legal position of the first bonding pad includes: The shape of the first bonding pad is simulated as a double rectangle.

6. The bonding pad placement method of claim 5, wherein the first bonding pad has an expanded width.

7. The bonding pad placement method of claim 5, wherein the first bonding pad has an inner rectangle closer to an element and an outer rectangle farther from the element, wherein the first bonding pad is connected to the element by a wire.

8. The placement method of the bonding pad as described in claim 7, wherein determining the legal position of the first bonding pad includes: First determine the position of the inner rectangle, then determine the position of the outer rectangle.

9. The placement method of the bonding pad as described in claim 5 further includes: Minimize the counterclockwise rotation angle of the first bonding pad relative to one of the wires connected to it.

10. The method of placing the bonding pad as described in claim 5 further includes: The shape of a second bonding pad adjacent to the first bonding pad among the plurality of bonding pads is simulated by a double rectangle.

11. The method of placing the bonding pad as described in claim 10 further includes: The shape of the second bonding pad does not overlap with the shape of the first bonding pad.

12. The method for placing the bonding pads as claimed in claim 1, wherein producing the placement result of the plurality of bonding pads includes producing a wiring diagram of the plurality of bonding pads relative to a component, wherein each of the plurality of bonding pads is connected to the component by a wire.

13. A method for placing a bonding pad, comprising: receiving information related to a first bonding pad; simulating a shape of the first bonding pad using a first rectangle and a second rectangle; and determining a valid position of the first bonding pad based on a relative position of the first rectangle and the second rectangle, wherein the first rectangle is closer to the component and the second rectangle is farther away from the component.

14. The method of placing the bonding pad as described in claim 13 further includes: First, determine the position of the first rectangle, then determine the position of the second rectangle.

15. The method of placing the bonding pad as described in claim 14 further includes: Receive information related to a second bonding pad; The shape of the second bonding pad is simulated by a third rectangle and a fourth rectangle; and a legal position of the second bonding pad is determined by the relative position of the third rectangle and the fourth rectangle.

16. The method of placing the bonding pad as claimed in claim 15, wherein the second bonding pad is connected to a component by a wire, wherein the third rectangle is closer to the component and the fourth rectangle is farther away from the component.

17. The method of placing the bonding pad as described in claim 16 further includes: First determine the position of the third rectangle, then determine the position of the fourth rectangle.

18. The method for placing the bonding pad as claimed in claim 17, wherein the position of the fourth rectangle is determined based on the position of the first rectangle, the position of the second rectangle, and the position of the third rectangle.

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