Installation tools and installation devices
TW202636997APending Publication Date: 2026-09-01SHIBAURA MECHATRONICS CORP
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Patent Information
- Application Number
- TW115103264
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-11-13
- Filing Date
- 2026-01-28
- Publication Date
- 2026-09-01
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Abstract
The present invention provides an installation tool and installation device that can suppress the occurrence of bump flattening. The installation tool (200) of the embodiment includes: a holding body (210) for holding a heated electronic component (1); and a support body (220) for supporting the holding body (210). The holding body (210) includes: a holding portion (211) for holding the electronic component (1) on a holding surface (211a) which is a lower surface; and a mounting portion (212) provided above the holding surface (211a) and having a mounting surface (212a) facing downward. The support body (220) includes: a receiving portion (221) for receiving the mounting portion (212) such that the holding surface (211a) is exposed downward and the holding body (210) can move up and down; and a support portion (222) for supporting the holding body (210) by contacting the mounting surface (212a).
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